IPDB › China Industry › Manufacturing & Processing Machinery
China, Chinese Lab DC/RF Dual-Head High Vacuum Magnetron Plasma Sputtering Coating Machine with Thickness Monitor1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Thermal Spray EquipmentPowder Coating MachinePowder Coating
HENAN RUNJING INSTRUMENT EQUIPMENT CO.,LTD
Preview:
Product Description Dual-Head Magnetron Plasma Sputtering system / Magnetron Sputter CoaterRJ-VTC-600-2HD is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and another RF source for coating non-metallic material. A film thickness tracker is included to enable the user to control processing easily. This coater is designed for coating both single or multiple film layers for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE etc. at low cost. Specification Input Power220VAC 50/60Hz, single phase2000W (including pump)Source PowerTwo sputtering power sources are integrated into one control boxDC source: 500W for coating metallic materialsRF source: 600W with automatching for coating non-metallic materials ( Center)Compact 300 RF source is available at extra costMagnetron Sputtering HeadTwo 2" Magnetron Sputtering Heads with water cooling jackets are includedOne is connected to RF power supply for no-conductive materialsAnother is connected to DC sputtering power source for coating metallic materialsTarget size requirement: 2" diameterThickness Range: 0.1 - 5 mm for both metallic and non-conductive targetsOne stainless steel and one Al2O3 ceramic targets are included for demo testingHead Water Cooling: 10ml/min water flow required, and one 16ml/min digitally controlled recirculating water chiller is included for cooling both magnetron sputtering headsCustomized coater: Two DC head without, RF sputtering, RF head without DC sputtering, 3 RF head are available upon requestVacuumChamberVacuum Chamber: 300 mm Dia x 300 mm height, made of stainless steelObservation Window: 100 mm diameterHinged type cover on top with air spring sport makes target exchange easySample HolderSample holder size: 140mm dia. for. 4" wafer max (also can be designed as your requirement)Sample holder rotation speed is adjustable: 1 - 20 rpm for uniform coatingThe holder temperature is adjustable from RT to 500°C Max with accuracy +/- 1.0 °CGas FlowControlTwo precision digital MFC (mass flow controller) are installed to allow two types of gases to be filled inFlow rate: 200 ml/min max.Flow rate is adjustable on the 6" touch screen control panelVacuum PumpStationHigh speed turbo vacuum pump system (made in Germany) is directly installed on the vacuum chamber for max. vacuum levelHeavy duty dual stage mechanical pump is connected to turbo pump for faster pump speedMobile pump station is included and the compact sputtering coater can be put on top of stationMax. vacuum level: 10^-6 torr with chamber bakingThicknessMonitorOne Precision quartz thickness sensor is built into the chamber to monitor coating thickness with accuracy 0.10 ?LED Display Unit outside chamber can:5 pcs quartz sensors (consumable) are includedInput material to be coated according to data base includedDisplay total thickness coated and coating speedWater cooling is requiredOverallDimensionsL1300mm× W660mm× H1200mmNet Weight160 kgWarrantyOne years limited warranty with lifetime supportApplication NoteIn order to remove oxygen from the chamber, suggest you use 5% Hytrogen + 95 % Nitrogen to clan chamber 2-3 times, which can reduce oxygen to below 10 ppmPlease use > 5N purity Argon gas for plasma sputtering. Even though 5N purity Ar, usually contain 10- 100 ppm oxygen and H2O
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...