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China, Chinese Fab Semiconductor Device Fabrication Wafer Fab Feol MD-IDC9580 Inner Diameter Circle Slicer1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Stone Polishing Grinding MachineInner Diameter Circle SlicerGrinder and Polisher
Guangzhou Minder-Hightech co.,Ltd
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Product Description Product Description Inner diameter slicer and optical edgerProduct description:MD-IDC9580 Inner diameter circle slicerDetailsInner circle fully automatic slicing machine is using inside circle to cut a variety of semiconductors, crystal, ceramic, NdFeB magnetic material.Installed in the spindle, the edge-type Diamond blade cutter is high-speed rotating, the table was feeding by computer control of horizontal and vertical movement, the material on the fixture of the table was cut into the required product.We have the semi-automatic/fully automatic inner circle clicking machine, within a circle slicer two kinds of specifications, a variety of models. For the Automatic Slicer inner circle. a worker can operate about 16 units slicer at the same timeMD-IDC9580Main technical parametersMax machining size(mm):Φ95 ×80mmCutting speed (2/):3-6(2/)Degree of balance sheets by cutting deviation(mm):±0.005Cutting film thickness(mm):≥0.30The thin-cut tolerance (mm):±0.005Horizontal stroke(mm):120Longitudinal travel(mm):100Spindle Electrical:3 Phase 1.1kwSpindle Speed (r/min):2800Rev / minAdjust the amount of work clamp:Horizontal angle:±45oPitch angle of elevation:±10oVertically(mm):20Cooling tank capacity(kg) :50kgCooling tank motor:3 Phase 0.12kw 2780r/minPower:Three-phase four-wire 50Hz 380VDimensions(mm):1130mm*850mm*1500mmWeight(kg):~1400(kg)
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