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China, Chinese Semiconductor Device Fabrication Feol Beol Wafer Back Grinder Mdfd-300vst Grinder and Polisher1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Stone Polishing Grinding MachineGrinder and PolisherGrinder
Guangzhou Minder-Hightech co.,Ltd
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Product Description Product DescriptionApplication:mainly used at silicon wafer, ceramic,glass,quartz crystal,sapphire,semiconductors precision thinning(grinding) .it is made from sucker, sucker main axis,grinding wheel, grinding wheel main axis,and driving part and guide screw etc.Sucker: can be chosen to electromagnetism sucker or vacuum sucker,sucker diameter can be 320mm-600mm.Sucker main axis driving method is frequency control of motor speed, anti-clockwise rotary,speed 3-140 adjustable.Grinding wheel:the diameter of grinding wheel is depend on the diameter of sucker, have 150/170/210/300mm type. the granularity(roughness) of the grinding wheel is depend on the process.Grinding wheel main axis:frequency control of motor speed, 3000-8000 adjustable.Guide screw feeding part:high precision guide screw feeding part, serve driving, 0.001-5mm/min adjustable,it is checked by grating ruler.this machine is very easy for operator.Specification:sampleFactoryDetail
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