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China, Chinese High-Melting-Point Metal Method Mo-Mn Technology Alumina Ceramic Circuit Board1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Industrial Ceramic ProductsCeramic SubstrateMetallized Ceramic SubstrateCeramic Substrate with Metallization
SHENZHEN JINGHUI INDUSTRY LIMITED
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Product Description High-melting-point Metal Method Mo-Mn Technology Alumina Ceramic Circuit BoardProduct IntroductionWhat is Metallized Ceramic Substrates and Where are They Mainly Used?The metallized ceramic substrate is a ceramic plate obtained by metallizing the surface of the ceramic substrate by technical means. The ceramicsubstrate has better electrical function, thermal conductivity and insulation after metallization.Application of Ceramic Circuit Boards:1. LED field2. High power semiconductor module3. Semiconductor cooler4. Electric heater5. Power control circuit6. Power hybrid circuit7. Smart power components8. High frequency switching power supply9. Solid state relay10. Automotive electronics11. Aerospace and military electronic components12. Solar panel modulesProduction ProcessWhat is Mo-Mn Method?The Mo-Mn method is also called the high-melting-point metal method. It is based on the refractory metal powder Mo, and then mixes with a smallamount of low-melting-point Mn to the metallization formula, adds a binder to coat the ceramic surface, and then sinters to form a metallization layer.Process of Molybdenum-Manganese / Nickel Plating:1. A coating of Mo and Mn particles mixed with silicates and glass additives and volatile carriers is applied onto the ceramic surface to be brazed.2. The coating is fired in a wet hydrogen environment at 1450-1600oC, leaving a "glassy" metallic coating.3. The coating is subsequently plated with a layer of Ni.Our AdvantagesJinghui specializes in the production of metallized ceramic substrates, has rich experience in manufacturing ceramic circuit boards, and is proficientin the surface treatment process of ceramic substrates such as Mo-Mn method (high-melting-point metal method), electroless nickel plating, silverfiring and Direct Bonded Copper (DBC).How is Our Product Quality?Our products have been verified by the market for many years, their reliability and stability have been unanimously recognized by customers, andtheir quality has reached the leading level in the market.
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