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China, Chinese Alumina / Aluminum Nitride / Silicon Nitride Directed Plated Copper Dpc Substrate1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Industrial Ceramic ProductsCeramic SubstrateDirected Plated Copper SubstrateDpc Ceramic Substrate
Xiamen Innovacera Advanced Materials Co., Ltd.
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Product DescriptionDBC substrate short for Direct Bonded Copper substrate is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering applications. 1. Thickness of substrate can be thin: 0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm, 1.8mm,2.0mm2. Coating by Cu ,Mo/Mn,Ag, Plate with copper3. Excellent thermal conductivity4. High electrical insulationApplied Area * Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control * Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power transistors * Home Appliance: Air Conditioner, Peltier Cooler * Industrial: LED Displays, Welding Machine * Aerospace: Laser, Power Supply for Satellites and Aircrafts * Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power * PC/IT: Power Supply, UPS SystemCeramic Materials Properties1. High Thermal Conductivity 2. Low Thermal Expansion 3. High Strength 4. High Wettability for SolderDBC Design GuideItemUnitValueMaster Card Sizemm138x190 ±1.5%USABLE AERA 127×178Dimension Tolerancemm-4Copper Edge to Ceramic Edgemm±0.15Pattern Mismatchmm≤0.2Etch Factor->2ChiptL : max.1, W&D : 0.5Total Thickness%±7Surface RoughnessμmRmax=50 ; Ra≤3 ; Rz≤16Plating ThicknessμmAu: 0.01~0.1; Ni: 2~8Available Material Thickness and Combination96% Al2O3Copper ThicknessThickness0.1270.20.250.30.40.50.25√√√---0.32√√√√--0.38√√√√--0.5√√√√√√0.635√√√√√√1√√√√√√ZTACopper ThicknessThickness0.1270.20.250.30.40.50.25√√√√--0.32√√√√√√AlNCopper ThicknessThickness0.1270.20.250.30.40.50.38√√√√--0.5√√√√√√0.63√√√√√√1√√√√√√Material Specification & PropertiesItemAl2O3ZTAALNUnitContent96% Al2O390%Al2O3-%9%ZrO2Density3.753.953.3g/m3Thermal Conductivity>24>27>170W/m.KElectrical Resistivity>1014>1014>1014Ω·cmDielectric Constant9.810.591MhzDielectric Strength>20>20>20KV/mmDielectric Loss0.00030.00030.00051MhzBending Strength>350>600>350MPa(Σ0,M>10)Young’s Modulus340310320GpaCoefficient of Thermal Expansion6.87.5(40℃~400℃)4.7x10-6/K20℃~300℃)8.4(40℃~800℃)(20℃~300℃)
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