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China, Chinese Fangda Wafer Grinding Thinning Machine Precision Single-Axis Grinding Thinning Equipment1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Machine ToolsGrinding MachineThinning EquipmentGrinding Thinning Equipment
Shenzhen Ponda Grinding Technology Co.,Ltd.
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Product Description Product DescriptionWafer polishing machines are essential tools in the semiconductor industry. Here are the characteristics, performance, and parameters of wafer polishing machines:Characteristics:? High precision: They are designed to achieve extremely smooth and flat wafer surfaces with minimal surface roughness.? Reliability: Built with durable materials and advanced technology to ensure consistent performance over long periods.? Versatility: Capable of handling different wafer sizes and materials.? User-friendly: Equipped with intuitive interfaces and easy-to-operate controls.Performance:? Excellent polishing quality: Delivers uniform thickness and surface finish across the entire wafer.? High throughput: Can process multiple wafers in a short time, increasing production efficiency.? Stable operation: Minimizes vibrations and fluctuations for accurate polishing.? Low defect rate: Reduces the occurrence of scratches, pits, and other defects on the wafer surface.Parameters:? Polishing speed: Determines how quickly the wafer is polished.? Pressure control: Allows for precise adjustment of the polishing pressure to achieve the desired surface quality.? Wafer size compatibility: Specifies the range of wafer diameters that can be processed.? Power consumption: Indicates the amount of electrical power required for operation.? Machine dimensions: Gives the physical size of the polishing machine for installation and space planning.Product ParametersTERMPRAMETERApplicable Wafer Size2/4/6-inch 4/6/8-inchG.Wheel DiameterMedium 205 mmG. Wheel R. Speed500- 3000 min-1G. Wheel Motor Power5.5kWMax. Travserse Rate10 mm/sIn-Feed Resolution0.1μm/sFeed ing Motor Power0.4 kWNo. of Worktable2Worktable Rotat. Speed0-400 min-1Thick. Inspect. Accuracy0.5μmCCD Position. Accuracy2.5μmChamfering Roundness≤10μmChamfering Angularity±0.05°Diameter Control≤15μmExternal Dimension1200×1100×2100Total Weight2350kg WaferG.AmountNe of WaferDia. Before Grind ingDia. After GrindingRoundness Varia tionSapphire 4-inch0.01 mm199.63299.6136299.6199.5997399.699.5897499.59299.5794599.5899.5714CertificationsPackaging & ShippingCompany ProfileShenzhen Ponda Grinding Technology Co., Ltd. Was founded in 2007, is located in the Gongming Shangcun Yuanshan Industrial Zone B, is a professional engaged in a variety of high precision grinding equipment, polishing equipment and supporting products and consumption of materials of high-tech enterprises. The company integrates research and development, design, manufacturing, sales and after-sales service. Its products are widely used in optical glass lenses, mobile phone parts, LED sapphire, molds, parts of various communication electronic products, flat metal parts and various hardware industries. Customer base throughout the country and Europe, the United States, Japan and other regions. Its representatives include Huawei, CLP Group; America's Apple, Japan's Dashin, Panasonic; Germany Botu; Taiwan Foxconn and many other well-known Chinese and foreign enterprises. Ponda heretofore supplied more than 60, 000 process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; The substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.FAQQ1: Which machine is most applicable for my product?A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:1. If better flatness and roughness were required, you might need both lapping and polishing machine.2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.3. If the productivity were excessive, you might need larger machine or to expand production line.Additionally, we can confirm the production line as we make samples for you.Q2: Does Ponda charge for making samples?A: No, it's free to make samples.Q3: Is Ponda trader or manufacturer?A: We are manufacturer, certified National High-Tech Enterprise.Q4: How long does it take machine to deliver?A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.Q5: Does Ponda provide oversea setup and after-sale service?A: Yes, we provide oversea service and online tutorial.Q6: How many type of machine does Ponda manufacture?A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
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