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China, Chinese High Precision FPC Package Dispenser Machine Automatic Silicone Wafer Equipment Factory1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Manufacturing Equipment for Electrical Electronic ProductGlue Dispensing SystemFPC Package Dispenser MachinePackage Dispenser Machine
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description High Precision FPC Package Dispenser machine Automatic Silicone wafer Equipment factory Product Description High-Precision Desktop Dispensing System (TSV/HSV Series)Our TSV-300 & HSV-300 dispensing systems are computer-controlled, servo-driven solutions designed for ultra-precise fluid dispensing in SMT, FPC packaging, LED assembly, and semiconductor applications. Featuring visual programming, CCD alignment, and automatic error detection, this system ensures high repeatability, fast operation, and minimal human intervention for industrial production. Key Features & Advantages1. Advanced Control & SoftwareIndustrial PC + Motion Control Card - Ensures high-speed, stable operation for precision dispensing.Windows OS + Anda Control Software - Intuitive visual programming for easy setup.CCD Visual Positioning - Auto-alignment for accurate dispensing on PCBs and flexible circuits.Servo Motor Drive (X/Y/Z Axes) - Enables fast movement (800mm/s) with ±0.025mm repeatability.2. High-Speed & Precision DispensingWorking Area (X260 × Y260 × Z100mm) - Suitable for small to medium-sized PCBs.30cc Coating Capacity - Supports continuous dispensing without frequent refills.Vacuum Nozzle Cleaning - Reduces clogging & downtime for consistent performance.Automatic Coating Inspection - Detects dispensing errors in real time.3. Robust Safety & ReliabilityMenu + Sound & Light Alarm - Immediate error alerts for quick troubleshooting.ESD Grounding Point - Protects sensitive electronics from static damage.CE Certified - Complies with international safety standards.Voltage Stabilizer + UPS - Ensures stable power supply to prevent interruptions.4. Wide Application Compatibility SMT Red Glue Dispensing (PCB assembly) FPC Packaging (Flexible circuits) LENS & LED Encapsulation (Optical & display modules) Solder Paste Dispensing (Precision soldering) Fingerprint Module Assembly (Biometric sensors) Standard Features Computer Control, Windows OSCCD visual positioning systemServo MotorUPS and voltage stabilizerESD grounding point-CE certifed Optional Features Automatic constant temperature system to ensure the fuidity consistentLaser Height Detection to calibrate Z axis automatically for componentdeformationProduct advantage:TSV Series desktop dispensing system is applicable for LENS dispensing, FPC package, SMT red glue dispensing, solder past dispensing, LED package, fingerprint identifcation module, etc. Specifications TSV-300 HSV-300Dimension (mm) L810×W660×H760 L900×W650×H1460Weight (kg) 105 190Control Industrial personal computer + motion control cardSoftware Anda control software + windows systemProgramming Visual programmingNumber of spindles X,Y,ZSpindle drive Servo motor + moduleWorking area (mm) X:260 ; Y:260 ; Z:100Quantity of rubber valve 1 (standard configuration)Max. Moving speed (mm/s) 800Repeatability (mm) ± 0.025Coating capacity (cc) 30Valve nozzlecleaning device Vacuum cleaningEquipment alarm Menu + sound and light alarmCoating inspection Automatic detectionPower supply 220V 50/60HzRequired air pressure (Mpa) ≥ 0.65Safety standards CERated power (kw) 1Standard configuration CCD visual positioning; Electrostatic interface; 232 scanner socketApplications Wide application for: SMT Red Glue Dispensing (PCB assembly) FPC Packaging (Flexible circuits) LENS & LED Encapsulation (Optical & display modules) Solder Paste Dispensing (Precision soldering) Fingerprint Module Assembly (Biometric sensors)Exhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:Why choose us ?A3:OEM/ODM/Designing.
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