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Hunan DeZhi New Material Co., Ltd.
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Product Description Company ProfileHunan Dezhi New Material Co., Ltd. is a high-tech enterprise focusing on the research, development, production and sales of high-end materials such as carbon-based and ceramics. Dezhi is the first company to achieve mass production of Solid SiC etching components for semiconductors in China, and has high-end technology, equipment and a high-level R&D team. The company currently has about 300+ employees, of which R&D personnel account for 20%. Our R&D capabilities and product quality are unanimously recognized by the industry and main products include CVD@SiC coatings, Solid SiC, Sin@SiC-SiC, CVD@TaC coatings and other series of products, which are widely used in LED optoelectronics, integrated circuits, third-generation semiconductors and other fields.Product DescriptionDezhi advanced material products cover carbon-based, ceramic and other high-end materials, used in all aspects of semiconductor chip manufacturing, such as single crystal growth, epitaxy, etching, diffusion, CVD, PVD, etc. Product performance: High Temperature Resistance High Pressure Resistance Wear Resistance High Service Life Corrosion Resistance High Purity Materials and Characteristics?Substrate: Sintered SiC (thickness>0.5mm)?Coating: β-SiC (thickness<300μm) Application ScenariosWafer Fabrication? Epitaxial? Diffusion Implementation Technology? Precision Machining (Graphite)? Low Pressure Chemical Vapor Deposition Performance Requirements? High density? Strong combination? High purity? High thermal conductivity? Corrosion resistance? Resistance to cracking Application Areas? LED Photoelectric? Integrated circuits? Third-generation semiconductorsDetailed PhotosProduct ParametersProduct RangeMaterials and propertiesApplication ScenarioImplementation TechnologyPerformance requirementsCVD@SiC coating seriesSubstrate: Isostatic graphite (Thickness 1~20 mm) Coating: β-SiC (Thickness <100 μm)Wafer manufacturing Epitaxial growth DiffusionPrecision machining (graphite) Low pressure chemical vapor deposition (LPCVD)High density Strong bonding High purity High thermal conductivity Corrosion resistance Anti-crackingOur AdvantagesCorrosion Resistant SiC Silicon Carbide Ceramic Wafer Boat The Advantages of Using Ceramic Wafer Boat :1.Very high Temperature Resistance to 3000 F ( 1650oC )2. Super corrosion resistance to acids, solvents, salts, and organics, wear resistant 3. Easy to clean4. Strong impact resistance5. Slip FreeDifferent Models of ceramic wafer boat :The semiconductor manufacturing industry typically processes these wafers in either horizontal or vertical carriers. The horizontal carrier, typically called a "boat", has three or four horizontally disposed bars arranged in a semicircle design, with each bar having inwardly facing grooves set therein at regular intervals. Each set of grooves define a vertical space for carrying a vertically disposed wafer. The vertical carrier, typically called a "vertical rack", has three or four vertically disposed rods (or posts) arranged in a semicircle design, with each post having slots set therein at regular intervals to define a space for supporting a horizontally disposed wafer. To insure the geometrical precision required in this field, the three or four rods are fixed to a top plate and a bottom plate. The portions of the post between each slot, termed "teeth", are identically spaced in order to support wafers at regular intervals from and parallel to the bottom plate. The entire rack is then placed within a vertical furnace for processing the wafers.Because a wafer processed on a vertical rack experiences less of a temperature gradient over its face (as compared to a wafer processed in a horizontal boat), semiconductor manufacturers are increasingly turning to vertical furnaces. There is, however, a drawback to vertical furnacing. The wafers disposed on a conventional vertical rack are supported at their outside edge only. As such, the areas of the wafer resting on these teeth experience higher stress than the rest of the wafer. When temperatures in the furnace exceed about 1000°C, these stresses often become significant and portions of the single crystal wafer move relative to each other along crystallographic plates in response to that stress. This phenomenon, called "slip", effectively destroys the value of the semiconductor devices located in the area of the wafer where slip has occurred.Advantages of Hunan Dezhi New Materail1. Fast delivery response: Sample delivery 7-15 days & bulk delivery 1 month2. Flexible customization service: Dedicated production lines to match customer needs & Personalized service For product solution support3. Professional technical support: Professional material testing and analysis center & Quickly cooperate with development and verification needs4. Robust supply chain: Stable supply chain system, Many long-term cooperative suppliers with good reputation. CertificationsFAQQ. Are you a factory or a trading company?A: we are the leading factory of SiC Material Components For Semiconductors in China. Q. When can i get the price?A: We usually quote within 24 hours after getting your detailed requirements,like size, quantity etc. .If it is an urgent order, you can call us directly.Q. What about the lead time for mass product?A: The lead time is based on the details of the product, generally 20-30 working days.Q.What is your terms of delivery?A: We accept FOB, CFR, CIF, EXW, etc. You can choose the most convenient way for you.Besides that, we can also shipping by Air and Express.
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