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China, Chinese French Brot Multi Disc Grinder System Machine Industrial Equipment Producer1 Industrial Products Supplier Manufacturer Details, price list catalog:
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Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description French Brot Multi Disc Grinder System Machine industrial equipment producer Product DescriptionThe wafer roughing mill is a polishing machine equipped with diamond blades. It can use transparent technology to analyze and grind several samples to a thickness of less than 100 μ at the same time. This product is mainly used by geologists who are committed to studying a large number of ore samples.This product is fully automatic, fast and accurate, and can grind more than 20 samples in a few minutes.This machine replaces all traditional manual operation technologies: saw blade, grinding, rough grinding. It can easily, automatically and effectively solve the problems encountered in manual sample preparation in many laboratories.Performance:Size: width: 850mm; Thickness: 700mm; High:1100mm ; Weight: 190kgSample size: 20 30x45mm samples are processed at the same timeSample holder: 30x45mm and 45x60mmAccuracy: 1/100mmDiamond blade: 200mm in diameter, 6mm in width.Sample holder: 6~20 samples are placed in a grid, with two measurement units of mm or size. (10 standard units)Power supply device: network cable: 220/380V, three-phase, 50HZMotor: 2HP; Baffle: 1/6 HP; Cycle: 1/3RD HPCirculation unit: 461 capacityAfter the sample is glued on the standard plate table, the machine can grind the thin rock accurately to within 100 μ m in just a few minutesThe operator only needs to put the sample into the sample holder and then turn on the machine. There is no need for personnel to watch the whole grinding process. When the sound of machine operation is not heard, the whole grinding process is over. Exhibition&Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQ Q1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:Why choose us ?A3:OEM/ODM/Designing.
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