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China, Chinese Higher Accuracy Wire Bonding/Welding Machine for Sot, Sop, Qfp, DIP, BGA, COB1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Manufacturing Equipment for Electrical Electronic ProductOther Manufacturing Equipments for Electrical Electronic ProductSopQfpDIPBGACOBWire Bonding MachineWire Bonder for COB
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description Product Description High Speed Fully Automatic Gold/Copper Wire Bonder1,New servo system, faster response, higher accuracy, and higher UPH;2,New zoom lens, wider range, clearer images, and higher structural stiffness;3,New defense line module to improve consistency in wiring;4,More stable binding force control, more precise force response;5,Advanced bonding force calibration capability, fast and accurate, and easy to operate;6,Intelligent detection function, prompting users to perform timely calibration of bonding force;7,High precision post weld inspection function (PBI);8,New line arc algorithm, suitable for more materials and meeting the needs of complex products;9,The operation control drive system, optical system, and core components with independent intellectual property represent the leading level of the industry;10,Applicable to IC products:TO, SOT, SOP, SSOP, TSSOP, SOLC, QFP, DIP, BGA, COB, optocoupler, etcPerformance SpecificationsCategorySpecificationBonding Performance Bonding Cycle45 ms per wireApplicable Wire DiameterΦ15 ~ Φ50μm (Gold or Copper)XY Table & Positioning Drive MethodLinear Motor DriveMaximum Bonding AreaX: 56mm, Y: 80mmRepeatability±3μm (@ 3-sigma)Position Accuracy±3μm (@ 3-sigma)Inspection & CapabilitiesInspection FunctionHigh Precision Post Weld Inspection (PBI)Applicable IC ProductsTO, SOT, SOP, SSOP, TSSOP, SOLC, QFP, DIP, BGA, COB, Optocoupler, etc.Material Handling SystemParameterSpecificationInlet/Outlet StructureVertical StackedHandling MechanismMechanicalEquipment Material Box2~3Buffered Magazines2~3Magazine CompatibilityLength100 ~ 275 mmWidth30 ~ 90 mmHeight65 ~ 180 mmMagazine Pitch1.5 ~ 10 mmPhysical Dimensions & WeightParameterSpecificationDimensions (W x D x H)985 mm x 960 mm x 1770 mmWeight≈ 660 kg Key FeaturesHigh-Speed Fully Automatic Gold/Copper Wire Bonder - Technical SpecificationsThis machine is a high-precision, fully automatic wire bonder designed for a wide range of integrated circuit (IC) packages, featuring a new servo system, advanced optical system, and intelligent force control for superior performance and consistency.Key Features & Advantages:New Servo System: Faster response, higher accuracy, and increased Units Per Hour (UPH).Advanced Optics: New zoom lens for a wider view, clearer images, and higher structural stiffness.Intelligent Force Control: More stable and precise bonding force with advanced calibration and intelligent calibration prompts.Innovative Software: New line arc algorithm for more materials and complex products.Proprietary Technology: Features operation control, drive system, optical system, and core components with independent intellectual property.Exhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:How to choose a suitable machine?A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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