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China, Chinese Back Grinding Wheels for Silicon Wafers Thinning1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Abrasive GrindingSharpening StoneSilicon Wafer Grinding WheelDiamond Wheel
Zhengzhou Hongtuo Precision Tools Co., Ltd.
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Product Description Silicon Wafer Back Grinding Wheels Application areas and scope of application:It is mainly used for thinning and fine grinding of semiconductor wafersFeatures:1. Excellent grinding performance and high cost performance.2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.Product nameSilicon Wafer Back grinding wheelOEMSupportedAdvantageGood performanceSizeCustomizedBondDiamondGrit sizeCustomizedOEDSupportedPackageWoonden box & cartoon box
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