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China, Chinese Innovacera Plating with Ni Aluminum Nitride / Beo / Alumina Dbc Ceramic Substrate1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Industrial Ceramic ProductsCeramic SubstrateAlumina Ceramic Dbc SubstrateAlumina Ceramic Substrate
Xiamen Innovacera Advanced Materials Co., Ltd.
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Product DescriptionDBC (Direct Bonded Copper) tenique denotes a special process in which the copper foil and the al2o3 or AlN (one or both sides) are directly bonded under appropriate high temperature. The finished super-thin DBC substrate has excellent electrical isolation,high thermal conductivity, fine solderability and high bonding strength.It may be structured just lick PCB to get etched wiring and has high curreng loading capability .Therefore DBC ceramic substrates have become the base material of tuture for both the construction and the interconnection techniques of high power semiconductor electronic circuits and also have been the basis for "chip on boaed" technology which repre-sents the packaging trend in century. DBC Substrate Features:1.High mechanical strength,mechanically stable shape;high strength,fine thermal conductivity,excellent electricalisolation;good adhesion,corrosion resistant;2.Much better thermal cycling capabilities (up to 50000 cycles),high reliability;3.May be structured just like PCB boards or IMS substrates to get etched wiring;4.No contamination,environmentally clean;5.Wide application temperature:-55 ~ 850; The thermal expansion coefficient is closed to that of silicon, so production technologies of power module are greatly simplified. Specification >Metallization thickness: 25 ±10um >Nickel thickness:2~10um; >Pin full strength: 4200kgf/cm2 avg. (at Φ3.0mm pin) Characteristics: Specialized Alumina materials with high insulation resistance High-reliability ceramic tubes. Mo-Mn metallization with nickel plating allows customers to assemble hermetically sealed products. Joining types: Ceramic + Mo/Mn Metallized + plating Ni Ceramic + Mo/Mn Metallized + plating Ag Ceramic + Mo/Mn Metallized + plating Au Ceramic + printing Ag Special types are available according to customer's drawings or samplesApplied Area * Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control * Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power transistors * Home Appliance: Air Conditioner, Peltier Cooler * Industrial: LED Displays, Welding Machine * Aerospace: Laser, Power Supply for Satellites and Aircrafts * Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power * PC/IT: Power Supply, UPS SystemCeramic Materials Properties1. High Thermal Conductivity 2. Low Thermal Expansion 3. High Strength 4. High Wettability for SolderDBC Design GuideItemUnitValueMaster Card Sizemm138x190 ±1.5%USABLE AERA 127×178Dimension Tolerancemm-4Copper Edge to Ceramic Edgemm±0.15Pattern Mismatchmm≤0.2Etch Factor->2ChiptL : max.1, W&D : 0.5Total Thickness%±7Surface RoughnessμmRmax=50 ; Ra≤3 ; Rz≤16Plating ThicknessμmAu: 0.01~0.1; Ni: 2~8Available Material Thickness and Combination96% Al2O3Copper ThicknessThickness0.1270.20.250.30.40.50.25√√√---0.32√√√√--0.38√√√√--0.5√√√√√√0.635√√√√√√1√√√√√√ZTACopper ThicknessThickness0.1270.20.250.30.40.50.25√√√√--0.32√√√√√√AlNCopper ThicknessThickness0.1270.20.250.30.40.50.38√√√√--0.5√√√√√√0.63√√√√√√1√√√√√√Material Specification & PropertiesItemAl2O3ZTAALNUnitContent96% Al2O390%Al2O3-%9%ZrO2Density3.753.953.3g/m3Thermal Conductivity>24>27>170W/m.KElectrical Resistivity>1014>1014>1014Ω·cmDielectric Constant9.810.591MhzDielectric Strength>20>20>20KV/mmDielectric Loss0.00030.00030.00051MhzBending Strength>350>600>350MPa(Σ0,M>10)Young’s Modulus340310320GpaCoefficient of Thermal Expansion6.87.5(40℃~400℃)4.7x10-6/K20℃~300℃)8.4(40℃~800℃)(20℃~300℃)
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