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China, Chinese Hermetic Optoelectronic Packaging Solutions1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Ceramic MaterialMetal CeramicsHermetic Optoelectronic Packaging SolutionsCeramic Packages
Xiamen Innovacera Advanced Materials Co., Ltd.
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Product DescriptionCeramic Packages For Semiconductor Discrete Device Power ElectronicsCeramic Packages For Semiconductor Discrete Device Power Electronics Innovacera develops ceramic packages and metal packaging shells to meet customer customized requirements. Innovacera's factory has established robust capabilities in the research and development of ceramic and glass materials, tape casting for green ceramics, microwave/RF simulation, packaging technologies including the ceramic packaging shells/substrates, brazing/sealing, and surface treatment processes, offering customers comprehensive and integrated packaging solutions.Innovacera offers ceramic packages for semiconductor discrete device power electronics by using ceramic-to-metal sealing technologies. Ceramic packages adopt a ceramic sidewall structure instead of the traditional bead-type insulated ceramic design,significantly improving the voltage withstand performance of the housing. Copper-cored kovar lead pins and WCu heat sinks are bonded onto multilayer alumina ceramic packages or aluminium nitride ceramic packages. It is primarily used for encapsulating high-power transistors, diodes, triodes, and power modules.Ceramic Packages Current Carrying Capacity:Typical TO-Style PackagePackage ModelTO-254TO-257Plating StructureNi+AuNi+AuHeat Sink MaterialWCuWCuCeramic Size (mm)9.6×9.67.5×6.0Lead DiameterLead MaterialMax. Current Capacity1.0mmCopper-cored Kovar20A max0.8mmCopper-cored Kovar15A max1.0mmCopper60A max0.8mmCopper45A maxCeramic Packages Features:Ceramic Packages Features: Heat Sink Materials: WCu, CPC, CMC, etc.Lead Materials: Copper-cored Kovar, copper.Insulation Resistance: 1010Ω(500V)Withstand Voltage: > 1000V.Leak Rate: ≤1×103Pa ·cm3/sPlating Options: Full nickel plating, full Ni/Au plating.Sealing Method: Parallel seam welding.Temperature Cycling: -65℃~+175℃, 500 cycles.
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