IPDB › China Industry › Metallurgy, Mineral & Energy
China, Chinese Customized Ultrasonic 2 Into 1 Tinning Soldering Machine for Aluminum Components1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Metallic Processing MachineryMetal Drawing MachineryUltrasonic TinningDukane Sonic Tinning
Hangzhou Lanben Trade Co., Ltd.
Preview:
Product Description customized ultrasonic 2 to 1 tinning soldering machine for Aluminum components Basic Info. ConditionNewFrequency20kHzAmplitude of Vibration30umTransport PackageCartonSpecification45*22*27TrademarkRps-sonicOriginChinaProduction Capacity200PCS/MonthModel No.RPS-DS20Ultrasonic Frequency20KhzMaximum Output1000 WattTemperature Range150 ~ 400 oCPower Supply220V / 50-60 HzUltrasonic GeneratorSize250(W) x 310(L) x 135(H) mmWeight5 KgFeatureUltrasonic Amplitude AdjustablePot dimension20*15cmAvail Soldering MatrialITO Glass, AL, Mo, Cu etc., Ultrasonic tinning is a kind of welding method that does not use flux. The ultrasonic probe produces cavitation in the molten solder core through mechanical vibration at ultrasonic frequency, and removes the oxide film on the metal surface for smooth and clean tinning. Ultrasonic tinning is a flux-free connection method in which high-frequency mechanical vibration replaces flux. Ultrasonic tin furnaces of different sizes can be customized according to different welding material sizes of customers. It can also be modified on the basis of the customer's existing tin furnace, adding ultrasonic instead of flux for environmentally friendly tinning. We offer a variety of methods to acoustically activate molten metal. Another popular method is to immerse a Power Probe's Wear-Tip directly into the molten material. The ultrasonic energy will remove dissolved gases and enhance grain structure refinement. The Permendur Power Probe offers the ability to acoustically activate molten metal in continuous or batch casting operations. Ultrasonic soldering is used to join materials with either a metallurgical or mechanical bond.A metallurgical bond is formed when the oxide from the base metal is removed through ultrasonic cavitation and implosion in the solder. The solder then comes in to contact with the base metal and the ionic attraction between the two forms a bond. A tin or lead solder bonded to copper is an example of this. A mechanical bond usually involves no oxide on the base material. The cavitation and implosion in the solder create forces that agitate the materials and form an interlocking mechanical bond.Coating a ceramic with solder is an example of this process. When to use Ultrasonic SolderingThere are two main reasons for using Ultrasonic Soldering:1. To eliminate the need for flux in the soldering process2. To apply solder to ceramics and similar materialsThe advantages of removing flux from the process are that there is no need for post-processcleaning and wicking caused by surface tension from the flux is removed. Eliminating post-processcleaning has the obvious benefit of cost saving for both the process and the flux itself. The benefit ofeliminating wicking is that the solder coating on the base material can be better controlled.Aluminum componentsFerrite componentsGlass componentsSilicon wafersCeramic componentsSemiconductor chipsMetals etc.
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...