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China, Chinese Implement Rough Grinding and Fine Grinding Processes Fully Automatic Wafer Chamfering Machine1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Metallic Processing MachineryChamfering MachineWafer Chamfering MachineChamfering Machine
Shenzhen Ponda Grinding Technology Co.,Ltd.
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Product Description Product DescriptionThe FDC wafer edge grinder is mainly used for edge chamfering of wafers. During the manufacturing process of chips, there may be issues with unevenness and sharpness at the edges, which may affect subsequent processing and use. Using a wafer edge rounding machine can round the edges of the wafer to make them more uniform and smooth, while removing sharp edges and reducing damage to subsequent processes and equipment.The benefits of edge grinding (chamfering) mainly include the following three aspects.1. Prevent wafer edge fragmentation. During the manufacturing and use of wafers, they are often hit by robotic arms, which can cause the edges of the wafer to crack and form stress concentrated areas.These stress concentrated areas will cause the wafer to continuously release polluting particles during use,This in turn affects the yield of the product.2.Prevent the concentration of thermal stress. Wafers undergo numerous high-temperature processes during use, such as oxidation and diffusion, when the thermal stress generated in these processes exceeds that of the silicon lattice.When the strength is high, dislocation and stacking fault defects will occur, and grain edge rounding can avoid such defects.Produced at the crystal edge.3.Increase the flatness of the epitaxial layer and photoresist layer at the edge of the wafer. In the epitaxial process, the growth rate of sharp corner areas is higher than that of flat areas, therefore, using ungrounded wafers is prone to protrusions at the edges. Similarly, when using a rotary coating machine to apply photoresist, the photoresist solution will also accumulate at the edges of the wafer, and these uneven edges will affect the accuracy of the mask focusing.Detailed Photos Product ParametersTERMPRAMETERApplicable Wafer Size2/4/6-inch 4/6/8-inchG.Wheel DiameterMedium 205 mmG. Wheel R. Speed500- 3000 min-1G. Wheel Motor Power1kWMax. Travserse Rate10 mm/sIn-Feed Resolution0.5μm/sFeed ing Motor Power0.4 kWNo. of Worktable2Worktable Rotat. Speed0-400 min-1Thick. Inspect. Accuracy0.5μmCCD Position. Accuracy2.5μmChamfering Roundness≤10μmChamfering Angularity±0.05°Diameter Control≤15μmExternal Dimension2000×1150×1950Total Weight1000 kg WaferG.AmountNe of WaferDia. Before Grind ingDia. After GrindingRoundness Varia tionSapphire 4-inch0.01 mm199.63299.6136299.6199.5997399.699.5897499.59299.5794599.5899.5714CertificationsPackaging & ShippingCompany ProfileShenzhen Ponda Grinding Technology Co., Ltd. Was founded in 2007, is located in the Gongming Shangcun Yuanshan Industrial Zone B, is a professional engaged in a variety of high precision grinding equipment, polishing equipment and supporting products and consumption of materials of high-tech enterprises. The company integrates research and development, design, manufacturing, sales and after-sales service. Its products are widely used in optical glass lenses, mobile phone parts, LED sapphire, molds, parts of various communication electronic products, flat metal parts and various hardware industries. Customer base throughout the country and Europe, the United States, Japan and other regions. Its representatives include Huawei, CLP Group; America's Apple, Japan's Dashin, Panasonic; Germany Botu; Taiwan Foxconn and many other well-known Chinese and foreign enterprises. Ponda heretofore supplied more than 60, 000 process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; The substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.FAQQ1: Which machine is most applicable for my product?A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:1. If better flatness and roughness were required, you might need both lapping and polishing machine.2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.3. If the productivity were excessive, you might need larger machine or to expand production line.Additionally, we can confirm the production line as we make samples for you.Q2: Does Ponda charge for making samples?A: No, it's free to make samples.Q3: Is Ponda trader or manufacturer?A: We are manufacturer, certified National High-Tech Enterprise.Q4: How long does it take machine to deliver?A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.Q5: Does Ponda provide oversea setup and after-sale service?A: Yes, we provide oversea service and online tutorial.Q6: How many type of machine does Ponda manufacture?A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
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