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China, Chinese LED Copper-Aluminium Clad Heat Sink Substrate Customized1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
AluminumAluminum SheetHigh Thermal ConductivityHigh Strength Clad
Zhejiang Zegota Precision Technology Co., Ltd.
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Product Description Product DescriptionUsed in the LED lighting industry encapsulation heat dissipation substrate, LED chips are directly encapsulated in the copper surface, the heat generated by the chip from the copper directly have a point of conduction to the whole surface, and then through the aluminium dispersed, giving full play to the good thermal conductivity of copper and aluminium good heat dissipation performance, is currently an ideal not only to improve the thermal conductivity of the LED chip, heat dissipation efficiency, and can reduce the cost of production of a new COB encapsulation of the heat dissipation of the substrate material.SpecificationNameLED Copper-Aluminium Clad Heat Sink SubstrateThickness0.3~2.0mmWidth600~1000mmState of AffairsH18/H24Clad Rate100%Tensile Strength130~220MPaElongation10~20%Copper Layer Thickness Ratio10~20%Features1,Flat plate shape, high mechanical strength.2,Metallurgical bonding between copper and aluminium, 3,No delamination in extreme cold and heat.ImageCompany ProfileZhejiang ZEGOTA Precision Technology Co.,LTDOur company dedicate to precision technology innovation. As a technical enterprise, we highly specialized our R&D capability to make high quality and high performance products through continuous investment in staff training and sophisticated equipment, and to promote the construction of an intensive society for efficient utilization of materials and exploring future manufacturing ways
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