IPDB › China Industry › Packaging & Printing
China, Chinese Achieve Perfect Alignment with Precision Wafer Mounting Equipment System1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Packing MachineryLaminating MachineWafer Mounting SystemWafer Mounting Equipment
Jiangsu Himalaya Semiconductor Co., Ltd.
Preview:
Product Description Product Description A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure uniform adhesion. Wafer Laminator The wafer laminating machine is a machine that coats the blue film or UV film on the wafer and the FRAME iron ring frame, so that the wafer and the FRAME iron ring frame are fixed together. This equipment can stretch and cover the film on the semiconductor (wafer, glass, LED, PCB), and paste the film on the back of the wafer, that is, the cutting frame, through the circular knife and the cross-cutting knife, and can also protect the film from the Patterned wafer surface lift-off. Parameter DimensionL933*W450*H317mmCompatible size6"~8"Total power500WInput power supply100-240V AC 50-60HZAir pressure0.5-0.8MpaFilm typeBlue film/UV filmPlate heating temperature0~65oCFilm thickness0.05~0.2mmFilm functionManualFilm cutting functionManual rotary The main function 1. Suitable for blue film, UV film, PET substrate film and double layer film.2. An optional micro-hole film platen that can be applied to ultra-thin wafers.3. The heated and elastic lamination plate can be adapted to different thicknesses of wafers.4. Unique film roller pressure adjustable design.5. Equipped with circular cutter and cross cutter.6. Optional plasma air bar electrostatic removal device.7. Small size, desktop placement type. Key Features Vacuum-sealed environment - Prevents air entrapment & delaminationPrecision temperature control - For thermally activated adhesives (EVA, POE, etc.)Adjustable pressure system - Ensures even bonding without damageAutomated / semi-automated operation - For high-throughput manufacturing Primary ApplicationsSolar Panel ManufacturingEncapsulation of PV cells with EVA/POE films & backsheetsPrevents moisture ingress & improves durabilityPrinted Circuit Boards (PCBs) & Flex CircuitsMulti-layer PCB lamination (FR4, polyimide films)Flexible PCB bonding (smart devices, wearables) Electronics & DisplaysTouch panel lamination (OGS, cover glass bonding)OLED/QLED display encapsulationAutomatic substrate laminating machine is our independent research and development, manufacturing of high performance, high stability, high yield automatic substrate laminating machine. Manually place the material box or Magazine containing the substrate and the membrane ring into the device. Equipment operation will automatically take out the substrate in the material box or Magazine, put it into the working area, the membrane ring is also put into the working area; Then automatic film, film cutting operations. After finishing the film, put the finished product into the receiving box. Save manpower, avoid human-caused errors and increase output.Characteristics01 Compatible with multi-size substrate \film ring applications02 Magazine/Material box/basket canbe loaded without stopping03 Product switching is quick and easy04 Menu function options fordifferent applications05 High stability,no bubbles06 High speed production mode withhigh precisionOperation:1. First set vacuum time 15s, laminating 35s,remove bubble 3 min,temperature 40oC2. Press "automatic" start pre-heating3. Open laminating door4. Tear protect film and take inside the mould5. Take glass with frame on LCD6. Click LCD centre when in right position7. Put laminating mould on LCD8. Take LCD corner something out, prevent broken LCD9. Take glass inside in laminating zone10. Then lid on, press start.11. After wait setting remove bubble time, automatic exhaust12. Take screen out, finish. Detailed Photos Exhibition & CustomersField ApplicationFilm Frame Mounter: ApplicationsA Film Frame Mounter is essential in semiconductor manufacturing for bonding wafers to tape and frames. Key applications include:Wafer Dicing Preparation: Mounting whole wafers onto film frames before dicing to hold dies in place during cutting.Die Attach Preparation: Re-mounting diced wafers onto new frames after expansion, creating optimal spacing for die pickup.Advanced Packaging: Handling ultra-thin wafers in processes like Fan-Out WLP using special UV tapes for support and easy release. Packaging & ShippingPackaging: Materials: Hardened plywood crate, shock-absorbing foam, desiccant, anti-corrosion strips.Freight: Air-freight, sea-freight or railway FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:How to choose a suitable machine?A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...