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China, Chinese Co-Polyamide Hot Melt Adhesive PA5703-Hj Low Temperature1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
AdhesiveHot Melt AdhesiveCopa Hot MeltLow Temperature PA
Ningbo Huiju Polymer Materials Co., Ltd
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Product Description Melting point oC 90-100Melt flow rate(2.16kg) 160oC g/10min 5Particle Size Distribution(PSD) Pressing temperature Density g/cm3 1.1 PA5703-HJ is an ultra-low temperature high-performance copolyamide hot melt adhesive granule product. It is mainly used spinning, adhesive films, and special material coatings, suitable for cast or roll coating processes, and has a high modification base that can be used as a modifier for material additives. It features an ultra-low melting point, excellent chemical resistance, low bonding temperature, and high strength. It also exhibits excellent resistance to yellowing COPA(0-80μm) is suitable for adding to adhesive pastes, with process applications including screen printing paste, hoting adhesive, and flocking paste. COPA (80-170 μm/150-250 μm) is suitable for powder spreading/lining double dot. Industry applications: Clothing lining (simple bonding process with good bonding strength and softness, both bonding and sealing), automotive interior (corion-resistant, fatigue crack-resistant, good sealing, and low resistance), footwear industry (solvent-free, non-flammable, good melt fluidity, adhesion, uniformity of the coating), and textile fabric rhinestone bonding industry. Textile fabric with rhinestones (0-80μm or 0-120μm for small stones, 8-170μm for medium stones, 150-250μm for large stones)
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