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China, Chinese High-Precision Double-Sided Chamfering and Edge Grinding Fully Automatic Chamfering Machine1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Metallic Processing MachineryChamfering MachineAutomatic Chamfering MachineFully Automatic Chamfering Machine
Shenzhen Ponda Grinding Technology Co.,Ltd.
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Product DescriptionMain Applications:This equipment is mainly used for high-precision double-sided chamfering and edge grinding of semiconductor materials such as silicon, sapphire, silicon carbide, and gallium arsenide; various polycrystalline or amorphous materials such as optical glass and quartz glass; various ceramics and other hard and brittle materials.Equipment Features:1. The equipment can chamfer 6-inch/8-inch wafers.2. It can chamfer 2 wafers at the same time, and can realize rough grinding and fine grinding processes with one key.3. It is designed with 5 cartridge boxes for 6-inch and 8-inch wafers.4. It has automatic cleaning and spin-drying functions, achieving dry-in and dry-out.5. All processes are fully automatic, and each step is carried out by a manipulator.6. The calibration and measurement of wafers are all completed by CCD vision positioning. The diameter, OF edge, center distance and dimension measurement of wafers before and after chamfering are automatically completed by CCD vision with program algorithm.Factory:Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.Detailed drawingLeftbehindFrontMain Technical Parameters:Grinding Wheel Stroke10mmCCD Positioning Accuracy2.5 μmGrinding Wheel Fast Speed10mm/sTransfer X-axis Stroke1350mmMinimum Motion Resolution ofGrinding Wheel0.5 umRepetitive Positioning Accuracy of Each Axis2 umMain Grinding Wheel Diameter202mmRunout of Grinding Platform Surface5 umThickness Measurement Resolution0.1 umConcentricity ofProduct and Grinding Platform±3 μmType of Clamping WorktablePorous Suction CupUltimate Vacuum Pressure-90KPaWafer Clamping MethodVacuum AdsorptionChamfer Angle+20 μm (Condition:Grinding Wheel Angle45°, TTV +10 μm)Bearing Spindle Speed0~35 rpmWafer Flatness Control Capability<10 μmSuction Cup Cleaning MethodWafer ProcessingWorkbench AirBackflushAngle Control Capability+/-0.1 DegreeWafer Processing FlowCo-current FlowTotal Equipment Power380V-15kWWafer CleaningCleaning and Dryingvia Air-Water Two-Phase NozzleTotal Equipment WeightApproximately 2000kgWafer Positioning Method3 CCD VisionPositioning Centersand Straight EdgesOverall Dimensions2295x1275x2000(LxWxH mm)You May LikeYou can click on the image above for details.Company ProfileShenzhen Fangda Lapping Technology Co., Ltd.Shenzhen Ponda Grinding Technology Co., Ltd. Was founded in 2007, is located in the Gongming Shangcun Yuanshan Industrial Zone B, is a professional engaged in a variety of high precision grinding equipment, polishing equipment and supporting products and consumption of materials of high-tech enterprises. The company integrates research and development, design, manufacturing, sales and after-sales service. Its products are widely used in optical glass lenses, mobile phone parts, LED sapphire, molds, parts of various communication electronic products, flat metal parts and various hardware industries. Customer base throughout the country and Europe, the United States, Japan and other regions. Its representatives include Huawei, CLP Group; America's Apple, Japan's Dashin, Panasonic; Germany Botu; Taiwan Foxconn and many other well-known Chinese and foreign enterprises. Ponda heretofore supplied more than 60, 000 process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; The substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.Why Choose Us?Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.Packaging & ShippingCertificationsFAQQ: Which machine is most applicable for my product?A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:1. If better flatness and roughness were required, you might need both lapping and polishing machine.2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.3. If the productivity were excessive, you might need larger machine or to expand production line.Additionally, we can confirm the production line as we make samples for you.Q: Does Ponda charge for making samples?A: No, it's free to make samples.Q: Is Ponda trader or manufacturer?A: We are manufacturer, certified National High-Tech Enterprise.Q: How long does it take machine to deliver?A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.Q: Does Ponda provide oversea setup and after-sale service?A: Yes, we provide oversea service and online tutorial.Q: How many type of machine does Ponda manufacture?A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
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