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China, Chinese Wafer Microwave Plasma Stripping Cleaning Machine1 Industrial Products Supplier Manufacturer Details, price list catalog:
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HENAN RUNJING INSTRUMENT EQUIPMENT CO.,LTD
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Product Description Product DescriptionThis is a batch wafer barrel-type microwave resist stripping equipment, applied for photoresist removal after high-dose ion implantation, dry etching, wet chemical processing, sacrificial layer removal, SU-8 photoresist removal, etc. Freely moving electrons generate plasma, which enters the chamber and processes the photoresist on the surface of the wafers in a quartz boat. By applying a microwave frequency of 2.45 GHz to the walls of the vacuum chamber, a large amount of sustained plasma can be produced. The chamber is suitable for 4-6 inch wafers in a quartz boat.This provides fast, non-destructive plasma cleaning. The system's plasma cleaning effect is achieved through chemical reactions between the activated free radicals and the photoresist on the wafer surface.Product Principle:The process gas is ionized into plasma by applying an electric field. The "active" components of plasma include ions, electrons, atoms, free active groups, excited state nucleons (metastable states), photons, etc. Plasma treatment utilizes the properties of these active components to perform oxidation, reduction, decomposition, crosslinking, and polymerization, thereby altering the surface properties of the sample. This optimizes material surface performance and achieves the goals of cleaning, modification, etching, and more.Industry Applications:Pre-bonding Treatment for Chips: Removes surface contaminants, increases surface wettability, enhances colloidal fluidity, and ensures bonding capability with other materials. Oxide removal facilitates solder reflow, improves chip-to-substrate connection, reduces delamination, and enhances thermal dissipation performance.Pre-Encapsulation Treatment: Removes surface contaminants to ensure strong bonding between the chip surface and encapsulation materials, reducing defects like delamination and bubbles.Photoresist Removal: Removes residual photoresist and other organics, activates and roughens the wafer surface, and improves surface wettability.Pre-Metal Bonding Treatment: Removes organic contaminants from metal pads, enhancing the strength and reliability of the bonding process. It also removes thin contamination layers, improving bonding strength and the uniformity of bond wire pull forces.Product Advantages:Flexible and adaptable fixture placement to accommodate irregular products.Low-temperature plasma avoids thermal damage to products.Electrically neutral plasma prevents electrical damage to products.Efficient and uniform plasma output ensures effective resist stripping.Product Parameters:Product nameMicrowave Plasma CleanerVacuum systemCavity materialQuartzCavity size250mm×460mm (diameter×depth)Vacuum degree15~45 PACavity leakage rate<=6 PABackground vacuum5PAVacuum pumpEquipped with a molecular pump systemProcess GasFlow rangeO2:1000sccm Ar:1000sccmProcess gas circuit(O2,Ar)+ 1 Road reservationDevice sizeLength 1000mm × depth 850mm × height 1700mmPower requirementAC380V, 50/60Hz, 5-wire, 40AMicrowave power supplyPower0~1250WFrequency2.45 GHz
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