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China, Chinese Wholesale Factory Price High Quality Diamond Lapping Slurry Diamond Suspension1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Abrasive GrindingSuperhard MaterialsDiamond Lapping Polishing SlurryDiamond Powder Slurry
SINO ZHENG INDUSTRIAL INC.
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Product Description Nano Diamond Slurry Grade HID-NDSFeature:It has the unique spherical microcrystalline loose structure of nano-diamond;Unique hyperdispersion technology makes the product have good dispersion effect;Angstrom-level surface processing effect can be achieved.Specification:Size(um)5080100150200300400500MediaWater / OilWater / OilWater / OilWater / OilWater / OilWater / OilWater / OilWater / OilApplication:Semiconductor wafer polishing: single crystal silicon wafer, polycrystalline silicon wafer, sapphire wafer, silicon carbide wafer, etc.;Polishing of magnetic recording materials: computer hard disk substrates, computer hard disk heads, etc.Single Crystal Diamond Slurry Grade HID-SDSFeature:Selected particle shapesStrict granularity controlUnique formulations for different applications.Specification:Size(um)MediaSize(um)MediaSize(um)Media0.05Water / Oil0-1Water / Oil8-16Water / Oil0.08Water / Oil1-2Water / Oil10-20Water / Oil0.1Water / Oil1-3Water / Oil20-30Water / Oil0.2Water / Oil2-4Water / Oil30-40Water / Oil0.25Water / Oil4-8Water / Oil40-60Water / Oil0.5Water / Oil6-12Water / Oil Water / OilApplication:1. Metal material processing: stainless steel, die steel, aluminum alloy and other metal materials2. Other material processing: optical glass, cemented carbide, etc.Polycrystalline Diamond Slurry Grade HID-PDSFeature:Selected polycrystalline diamond abrasives;High cutting force and good surface processing effect can be achieved in the processing of high hardness wafers;A variety of carriers are available for different processing areas.Specification:Size(um)MediaSize(um)MediaSize(um)Media0.05Water / Oil0-1Water / Oil8-16Water / Oil0.08Water / Oil1-2Water / Oil10-20Water / Oil0.1Water / Oil1-3Water / Oil20-30Water / Oil0.2Water / Oil2-4Water / Oil30-40Water / Oil0.25Water / Oil4-8Water / Oil40-60Water / Oil0.5Water / Oil6-12Water / Oil Water / OilApplication:1. Semiconductor wafer processing: mainly including sapphire substrates, silicon carbide wafers, sapphire windows, etc.2. Ceramic processing: zirconia fingerprint identification sheet, zirconia ceramic mobile phone back shell and other functional ceramics3. Metal material processing: stainless steel, die steel, aluminum alloy and other metal materials.Polycrystalline-Like Diamond Slurry Grade HID-PLDSFeature:It is an economical alternative to polycrystalline diamond slurry;The grinding effect of polycrystalline diamond slurry can be achieved in the processing of various semiconductor wafers.Specification:Size(um)0.250.51346MediaWater / OilWater / OilWater / OilWater / OilWater / OilWater / OilApplication:Semiconductor wafer processing: mainly including sapphire substrates, silicon carbide wafers, sapphire windows, etc.Ceramic material processing: zirconia fingerprint identification sheet, zirconia ceramic mobile phone back shell and other functional ceramicsMetal material processing: stainless steel, die steel, aluminum alloy and other metal materials.
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