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China, Chinese Advanced 2L Plasma Cleaner for Efficient Surface Sterilization1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Laboratory InstrumentsOther Lab InstrumentsLaboratory Plasma CleanerAdvanced Plasma Cleaner
HENAN RUNJING INSTRUMENT EQUIPMENT CO.,LTD
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Product Description Plasma Cleaner is designed for surface activation and modification of various powder materials (especially nano-powders), including:Carbon blackCarbon nanotubesCatalyst powdersMica powderSilicon dioxide (SiO)Polymer powdersWorking Principle:Surface Modification: High-energy particles in the plasma bombard powder surfaces, altering surface morphology and introducing active functional groups.Impurity Removal: Plasma treatment eliminates surface-adsorbed contaminants.Performance Enhancement: Improves powder properties such as:HydrophilicityDispersibilityCompatibilityFlowabilityCatalytic activityTechnical Advantages:Dynamic Processing: Unique rotating drum design ensures powders tumble continuously for uniform plasma exposure (vs. static treatment in conventional systems).Precision Control: Adjustable rotation speed optimizes process parameters for chemical modification.Dry Process: No solvent residues (unlike wet chemical methods), making it energy-efficient and eco-friendly.Key Innovations:Overcomes Limitations of Static Treatment:Traditional methods struggle with uniform modification beyond 10-nm surface layers due to powder stacking.The rotating system ensures full particle exposure, even for high-surface-area nanomaterials.Preserves Core Properties: Modifies surface physicochemical structure without compromising intrinsic particle performance.Technical Note:Operates under low-pressure conditions in a sealed chamber to maintain plasma stability.Ideal for R&D and industrial-scale powder functionalization. Product SpecificationsParameterDetailsModelNE-PE05XPower0-300W (adjustable)Plasma Generator Frequency40KHzChamber Material316 Stainless SteelChamber DimensionsΦ164 × D270mmMaterial Bottle SizeΦ76 × D225mmVacuum Degree<100PaGas Flow Controller0-500 SCCMGas Channels2 (Oxygen, Argon, etc.)Control System4.3-inch Touch Screen + PLCPower Supply220VOverall DimensionsL514 × W99 × H452mmThis system includes:Vacuum chamberRF generatorVacuum pumpGas inlet/outlet portsKey Features:Capacitively Coupled External Electrode DesignProcessor: Cylindrical quartz glass chamberEliminates electrode corrosion & reactant deposition issuesPlasma Discharge System200W high-frequency oscillator (13.56MHz)Integrated impedance matcher between power supply and electrodesPlasma TechnologyUtilizes low-temperature plasma to:Chemically/physically clean surfacesEnhance wettabilityImplant new functional groupsPerform surface etchingParameterDetailsModelNE-Q05HFrequencyRF 13.56 MHz (Solid-State RF Power)Power200WChamber MaterialQuartz Heat-Resistant GlassChamber Volume5LChamber Dimensions (Cylindrical)Φ150 × 280mm (D)Gas Flow ControllerMFC (Mass Flow Controller), 0-300 sccmGas Channels2 (Supports O, H, etc. For special gases, notify in advance)Vacuum Measurement SystemPirani GaugeUltimate Vacuum1PaControl MethodPLC + 4.3-inch Touch ScreenPower Supply220VOverall Dimensions548mm (D) × 588mm (W) × 617mm (H)Product Overview: Oxygen Plasma CleanerFunctionalityAn oxygen plasma cleaner is a surface cleaning and hydrophilic treatment device. It generates high-energy oxygen plasma by applying RF power to oxygen gas within a vacuum chamber. The activated plasma effectively cleans and modifies surfaces.Key ApplicationsSurface cleaning & activationGold coating pretreatmentPhotoresist removalMetal oxide reductionMild etchingOrganic contaminant removalHydrophilic modification experimentsPre-coating/pre-treatment for films & coatingsTechnical AdvantagesChemical-Free ProcessMaintenance-free operationNo consumables requiredSurface FunctionalizationIntroduces oxygen-containing groups:Hydroxyl (-OH)Carboxyl (-COOH)Carbonyl (-C=O)Enhances surface polarity & hydrophilicityWorking PrincipleOxygen plasma breaks down contaminantsReactive species graft polar functional groupsNon-thermal process preserves bulk material propertiesProduct SpecificationsParameterDetailsModelNE-OP2OFPower0-300W (adjustable)FrequencyRF 13.56MHzChamber Material316 Stainless SteelChamber Dimensions380(L) × 375(D) × 160(H) mmChamber Volume22.8LMax. Sample Size300 × 300mmUltimate Vacuum1PaControl Method4.3-inch Touch Screen + PLCGas Channels2 (Oxygen, etc.)Overall Dimensions650(L) × 575(W) × 635(H) mmInput Voltage220VTechnologyICP (Inductively Coupled Plasma) with External ElectrodesHigh plasma densityElectrode-free chamber design prevents sputtering contaminationHigh-Purity Quartz Glass Vacuum ChamberChemically inert & easy to cleanKey BenefitsSurface ModificationEnhances:AdhesionCompatibilityWettabilitySterilizationEffective disinfection & bactericidal treatmentApplicationsWidely used in:Optics & OptoelectronicsElectronicsMaterials ScienceLife SciencesPolymer EngineeringBiomedical ResearchMicrofluidicsProduct SpecificationsParameterDetailsModelNE-Q05FrequencyRF 13.56 MHz (Solid-State RF Power)Power0-200W (Adjustable)Chamber MaterialQuartz Heat-Resistant GlassChamber Volume5LChamber Dimensions (Cylindrical)Φ150 × 280mm (D)Touch Screen4.3-inchUltimate Vacuum1PaControl MethodPLC + Touch ScreenGas Channels (Standard)2 (Supports O, Ar, N, H, etc.)Overall Dimensions510mm (L) × 480mm (W) × 540mm (H)System CompositionVacuum systemVacuum chamberGas circulation systemPower control systemComputerized control unitTechnical FeaturesMulti-layer Processing ElectrodesMaximizes chamber utilization efficiencyAccommodates diverse cleaning requirementsPlasma FundamentalsPlasma represents the fourth state of matter (alongside solids, liquids, and gases)Generated when ionizing energy is applied to gas, producing:IonsElectronsExcited nucleiReactive radicalsPhotonsCleaning MechanismHigh-energy plasma activates surfaces through:Physical bombardmentChemical reactionsAchieves dry-state processing with superior efficiencyKey AdvantagesDry processing: No liquid residuesHigh effectiveness: Nanoscale cleaning capabilityEnergy-efficient: Lower operational costs than wet cleaningProduct SpecificationsParameterDetailsModelNE-PE10FPlasma FrequencyRF 13.56MHz (Auto Impedance Matching)Ultimate Vacuum1PaPower0-300W (Adjustable)Chamber Dimensions230(L) × 270(D) × 175(H) mmChamber Volume10LSingle-Layer Effective Processing Area208(L) × 215(D) mmProcessing Layers3Electrode Spacing55mmChamber Material316 Stainless SteelGas Channels2 (Supports O, Ar, N, H, etc.)Touch Screen4.3-inchControl MethodPLC + Touch ScreenPower Supply220VOverall Dimensions600(L) × 600(W) × 550(H) mmProduct Overview: NE-PE05F Compact RF Plasma CleanerWorking PrincipleThe NE-PE05F utilizes high-frequency alternating electric fields in a vacuum environment to generate plasma. This induces complex physicochemical reactions that:Remove surface contaminantsEnhance material adhesion and wettabilityPrepare surfaces for subsequent processing stepsKey FeaturesRF Plasma Technology (13.56MHz standard)Compact design for lab/bench-top useDry cleaning process (no solvents or abrasives)ApplicationsPre-treatment for:CoatingBondingPrintingRemoval of:Organic residuesOxide layersMicro-particulates ParameterDetailsModelNE-PE05FPlasma FrequencyRF 13.56MHz (Auto Impedance Matching)Ultimate Vacuum1PaPower0-200W (Adjustable)Chamber Dimensions (Cylindrical)Φ140 × 270mm (D)Chamber Volume5LEffective Processing Area130(W) × 245(D) mmChamber Material316 Stainless SteelGas Channels2 (O, H, N, etc.)Touch Screen4.3-inchControl MethodPLC + Touch ScreenPower Supply220VOverall Dimensions550(L) × 460(W) × 520(H) mm
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