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China, Chinese High Heat Diamond Cu Composite Material Low Price1 Industrial Products Supplier Manufacturer Details, price list catalog:
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Abrasive GrindingOther Abrasive Grinding ToolsCVD Heat Sink DiamondGold Coated CVD Diamond
Chenguang Machinery & Electric Equipment Co., Ltd.
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Product Description High Heat Diamond Cu Composite material low price Diamond Cu Composite MaterialDiamond/Cu is a high-performance composite material composed of diamond particles and copper substrate, which combines the ultra-high thermal conductivity of diamond and the excellent conductivity of copper. It is widely used in the heat dissipation field of high-power electronic devices.Specification parameters:Ultra high thermal conductivity: Diamond is the material with the highest thermal conductivity in nature (about 2000 W/m · K), while copper has a thermal conductivity of about 400 W/m · K. Diamond copper composite materials have a thermal conductivity of up to 500-1000 W/m · K, significantly better than pure copper and suitable for extreme heat dissipation needs.Low thermal expansion coefficient: Diamond has a low thermal expansion coefficient (1 × 10-6/K) and copper has a thermal expansion coefficient (17 × 10-6/K). By adjusting the diamond content (usually 40% -70% volume fraction), the thermal expansion coefficient can be reduced to 5-8 × 10-6/K, which matches semiconductor materials such as Si and GaAs and reduces thermal stress.Lightweight: Diamond has a low density (3.5 g/cm 3) and composite material density (about 5-6 g/cm 3), which is lower than pure copper (8.96 g/cm 3).High heat resistance: can withstand high temperature working environment (copper melting point 1083 oC, diamond is stable above 700 oC in an inert atmosphere).Application case:·Electronic heat dissipation: CPU/GPU heat sink, IGBT module substrate, laser diode heat sink.·Aerospace: Lightweight heat dissipation components for high-power devices such as satellites and radars.·5G communication: thermal management materials for base station RF modules.·New energy vehicles: power semiconductor (such as SiC devices) heat dissipation substrates for electric vehicles. ParameterCVD Single Crystal DiamondCVD Polycrystalline DiamondDiamond Coated Copper PlateDiamond CU Composite MaterialThermal conductivity(W/m·K)1800-22001200-1500600-1200500-800Coefficient of Thermal Expansion (10^-6/K)1.01.0-1.23-66.5-8Specific Heat Capacity (J/g·K)0.520.52//Density (g/cm^3)3.523.524.8-5.55-7Bending Strength (MPa)1500-2500800-1200500-800 200-500Insulation PerformanceInsulationInsulationInsulation/ConductionConductionHardness (Mohs)109.5N/AN/AThickness (mm)0.3-5.00.5-3.0Diamond Layer 0.3-1.0Copper layer 0.01-0.5Diamond Content 30-50% Copper Content 50-70%SizeDiameter 5-25 mmCustomizableDiameter 5-150 mmCustomizableOn Demand CustomizationOn Demand CustomizationTransparencyHigh TransparencyLow TransparencyN/AN/AChemical StabilityVery GoodVery GoodGoodGoodApplication FieldLaser, High-power Electronic devices, Optical EquipmentHigh Power Electronic devices, LED lighting, Industrial ProcessingHigh Power Electronic Devices, Power Modules, Microelectronic DevicesHigh-frequency Devices, Laser Diodes, Microelectronic DevicesMONO/SINGLE CRYSTALLINE Size:- 1X 1 mm to 8 X 8 mm,10-12mmThickness:- 0.3mm to 3mm Grade and application Industry (for Mechanical applications, Making Wheel Dresser,die Blank,etc.)Electronic (for Quantum optics, radiation detector, etc.)Optical(for precision tools, window, anvil, sensor, etc.)Thermal/Mechanical (for conventional tools)SurfaceAs Grown or Laser CutPolished (Ra< 5nm, Flatness < 1 fringes @ 633nm)Lapped (Ra< 200nm, Flatness < 1 fringes @ 633nm)Type/OrientationTop (100), Customized for Scalpels (based on 2 and 4 point configuration)Customized shapes (based on given designs)EdgesLaser cut and both polishedCrystal growth process:Mono CVD diamond Color:Normal grade - Near colorless, Mechanic grade - Brown Advantage:1) Regular shape, uniform size. The size can be strictly controlled according to customer needs.2) High repurchase rate and high cost performance, well received by customers.3) No visible growth lines,under 100x microscope, no black spots, no impurities, no crack.4) The stress is good, the number of times of reuse is high, and it is not easy to cracSize7*7 8*8 9*9 10*10 11*11 12*12 Thickness: 0.05-3mmOrientation:4pt/100Shape:Square,Triangles, rectangles, swordsLateral Dimensions Measuredto smaller sideEdgesLaser CutLaser Kerf< 3°Lateral Tolerance:+0.1/-0 mmRoughness, Ra1. Two sides polished, Ra <10- 30 nm 2. One side polished, the other size is The other side is the cutting surface, or grow 3.Both sides are unpolishedCustomized shape and size are available! Applicationa, cutting tools for non-ferrous and non-metallic materials.b, dressers for wheel dressingc, a variety of speciallity knivesd, burnishing tools, cutting toolse, wear partsf, wire drawing diesg, optical window
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