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China, Chinese 3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Optical Lens InstrumentMicroscope3D Digital Microscope3D Imaging
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product DescriptionProduct DescriptionFeatures(1) 0.6-4.5X zoom, operational distance 86mm, based on the infinite optical system.(2) 3D observation supports manual switch, 360-degree rotation and objective lens 45-degree range, keeps focus to ensure a high pixels of graph upon continous zooms.(3) CCD interface with micro-tunning function to be compatible with any type of CCD camera. No need to rotate the lens body and camera at the time of micro-tunning.(4) Vision filed by the minimum zoom is full of flame of camera, without black bargin, with high pixel and large vision depth.(5) Widely applied in microelectronic, precision circiut, precision mechanical parts, deep hole wall, biologists, animal/plant status, criminal investigation etc.SpecificationLens parametersOptical zoom0.6-4.5XTotal zoom11-95X based on 12.5" monitorOperational distance86mmZoom rate1:8.3Vision field24*13.5-2.88*1.62mmInterfaceType-C3D rotary observation3D manual switchRefocusing not needed, without distance change at the time of 3D switchWithout focus change at the time of 3D switch 360-degree rotation, 45-degree range objective lensCamera parametersGraphic sensor1/2" SONY CMOSSolution1920*1080Pixel dimension3.75μm*3.75μmWhite balanceManual/automaticExplosionManual/automaticRecording formatpictures on USB flash diskFormat: JPG/BMP Solution: 1920*1080Optical parametersRange controlBrightness 0-100% settingRay colorWhiteLED QTYLEDLux15000 LuxWave length455-457.5Output voltage12VOutput power8-10 WattOperational distance35-110mmMaterialAlluminium alloyDimensionsInner diameter: 40mm Outter diameter: 106mm Height: 19mmBracket parametersBracketCylindrical beam micro-tunning bracketBase size330*300mmCylindrical beam height328mmMain body size50mmPacking & DeliveryCompany ProfileJiangsu Himalaya Semicondutor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in exporting business and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!We manufacture equipments for Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting(Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine(Wafer Packaging)), Automatic Silicone Dispensing Equipment.As well as we provide some solutions for handling exhausted metal sorter equipments, customized coating and plating machine, TGV & manual/semiautomatic/automatic equipments, so on.
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