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China, Chinese 0.25mm 0.63mm 1.0mm Ceramic Thin Sheet 96% Alumina Ceramic Laser Cutting Drilling Substrate1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Industrial Ceramic ProductsCeramic Substrate96% Alumina Ceramic Laser Cutting SubstrateAlumina Ceramic Laser Cut Scribing Substrate
Xiamen Innovacera Advanced Materials Co., Ltd.
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Product Description The Aluminum oxide (Al2o3 96%) ceramic substrate are widely used in thick-film circuit of electronics industry. Large scale integrated circuit,power hytrid IC,semiconductor package,pieced -film reistor, network,resistor, focusing potentiometer etc.According to the demands of customers,our company can manufacture products of special types and specifications. The Maximum dimension of ceramic plate is 138x138mm and the thickness of ceramic plate ranges from 0.25 to 1.0mm. Alumina Ceramic Substrate Features: > High reliablility and sfety; > High density and mechanical properties > High electrical and thermal loading perormances > Low dilelectic loss and other characteristics Alumina ceramic substrate / plate specification:10x10x1mm, 20x20x2mm, 40x40x8mm, 100x60x8mm, 150x150x12.5mm, 200x200x25mm etc.Can be made according to your requirements. Main Technical Specifications of Al2o3 (96%) Ceramic SubstrateMaterial property Units96% Al2o3Color \WhiteMedium Grain Size μm3-5Surface roughness μm0.6maxDensity /m33780Rate of water absorption %0Bending strength 4 point method (40 x 4 x3mm3) Mpa400Dual ring method (0.63mm substrate thickness) Mpa500Modulus of Yang Gpa340Thermal conductivity (20-100) W / M.K24Specific heat j/kg.k800 Coefficient of Linear expansion20-30010-6/k6.8 20-600 7.3 20-1000 8Dielectric constant1 MHz 9.8±10% 1 GHz 10.0±10%Dielectric loss factor ( 1 MHz ) 10-30.3 Breakdown Voltage 1mm substrate thickness1mmkv/mm15 0.63mm 20 0.25mm 28 Volume resistivity20.cm1013 200 1012 400 1011 600 108 Alumina Ceramic Substrate Laser Cutting Processing Our company has been equipped with high precision laser cutting processing installations. The lasers are used for scribing,cutting and drilling substrates ( Minimum hole diameter:0.1mm ;Minimum hole spacing betwwen holes:0.2mm; circular accuracy:0.05mm;width of cutting seam:0.1~0.15mm; Depth of cutting seam:30% ~ 50% of thickness of ceramic substrates;thermal trsnsmissiong region:0.025mm).It has high cutting accuracy,very small tolerance,eliminating the time -consuming and costly tool fabrication stage,as well as increasing the goods supply efficiency by s big margin and shortening the processing circle. Laser cutting method allows to produce substrates with various outside contour geometries, hole patterns,cut-outs and snap-lines. Laser-scribed multiple substrates can be supplied in all common machine formats from 2 inch x 2 inch to 5.4inch x 7.4 inch ,the thicknesses of processing usbstrates are 0.25,0.38,0.5,0.63,0.76,1.0mm. PRODUCT DETAILS --- Alumina Ceramic Property Property Unit92% Alumina Ceramic95% Alumina Ceramic99% Alumina CeramicDensity g/cm3≥3.63≥3.68≥3.83Water absorption %OOOSintering temperature °C1500-17001600-18001700-1800Hardness HV≥1400≥1500≥1650Flexural strength Kgf/cm2300030003000Compressive strength Kgf/cm2240002500026000Fracture toughness Map.m3/23~43~44~5Maximum temperature °C160017001800Coefficient of thermal expansion /°C8*10-68*10-68*10-6Heat shock T(°C)220220220Thermal conductivity W/m.k(25-300°C)25 1425 1425 14 20°C >1012>1012>1012 RFQ 1.What's the max using temperature ?Max 1700degree 2.Which composition suitable for metallized ceramics?95% alumina 3.What's the 99 alumina's major applications?Pump Shaft,Drive Shaft,Sealing Ring 4.Can you do OEM?We are mostly doing by drawing 5.What's the delivery time?About 35days SEND MEIf you are interested in our products, please click here to send me an inquiry, and I will reply you within 8 hours
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