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IPDBChina IndustryManufacturing & Processing MachineryEtching Machine



China, Chinese High-Aspect-Ratio Deep Reactive Ion Etching of Silicon Etcher System1 Industrial Products Supplier Manufacturer Details, price list catalog:

China Industrial Products Supplier Manufacturer List Catalog
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Etching MachineDeep Reactive Ion Etching of SiliconIon Etching Machine

Jiangsu Himalaya Semiconductor Co., Ltd.

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Product DescriptionDeep Reactive Ion etching of SiliconICP EtcherThe ICP Etcher is a high-performance etching equipment designed for precision manufacturing in advanced technology fields, with comprehensive capabilities and flexible adaptability to meet diverse application needs.Introduction1. Product Process Application TypesIt supports a wide range of etching processes, including Si & Poly Etching, Dielectric Film Etching, Metal Etching, Deep Silicon Etching, Silicon Carbide (SiC) Etching, Gallium Nitride (GaN) Etching, Aluminum Nitride (AlN) Etching, and Optical Waveguide Etching. This broad process coverage enables it to handle various material etching requirements in high-tech manufacturing2. Target Application FieldThe equipment is widely applicable to multiple key technology sectors, such asSi-based processesCompound semiconductor fields (including GaN, GaAs, SiC, etc.)MEMS (Micro-Electro-Mechanical Systems)FiltersMicro-display technologiesIts versatility makes it a core tool in both foundational and cutting-edge manufacturing scenarios3. Flexible Transfer Platform ConfigurationTo align with diverse user needs, the ICP Etcher offers flexible transfer platform configurations. It is well-suited for different application scenarios, including universities and research institutions, R&D lines, pilot production lines, and large-scale mass production lines, ensuring optimal compatibility with varying production scales and research objectives.SpecificationParameter  categoryDetailsProcess ApplicationDeep silicon etchingWafer size compatibility8 inches and below (≤ 8 inches)Applicable substrate materialsSilicon (Si), Silicon Carbide (SiC)Packing & DeliveryPackage & Delivery Description for DRIE MachinePackaging: Wooden crate (ISPM 15-compliant, fumigated) Shock-absorbing foam + waterproof wrappingShipping Options: Sea Freight (20'/40' container)Railway Freight: (Eurasia/domestic)  (China-Europe rail)Company ProfileCompany IntroductionJiangsu Himalaya Semiconductor Co., Ltd. is a rising star in the semiconductor equipment manufacturing industry, committed to driving innovation and efficiency in the field of semiconductor processing. Since its establishment in 2023, the company has been dedicated to providing high - quality, advanced semiconductor equipment solutions.One of the company's flagship products is the ICP Etcher, which showcases the company's technical prowess and understanding of the market's needs. This high - performance etching equipment is designed with a focus on precision manufacturing in advanced technology fields. It combines comprehensive capabilities and flexible adaptability, making it a top choice for customers with diverse application requirements.FAQ1. Process & Material CompatibilityQ1: Can the ICP Etcher handle both silicon-based and compound semiconductor materials?A1: Yes. It supports etching for silicon-based materials (via Si & Poly Etching, Deep Silicon Etching) and compound semiconductors (including GaN, SiC, and GaAs, through specialized processes like Gallium Nitride Etching, Silicon Carbide Etching). This makes it suitable for cross-field applications in both Si-based and compound semiconductor manufacturing.Q2: Is the ICP Etcher capable of etching optical waveguides?A2: Absolutely. Optical Waveguide Etching is one of its core process application types, optimized to meet the precision requirements of waveguide fabrication for photonics or optical communication components.2. Customization & AdaptabilityQ3: Can the transfer platform be adjusted for different production scales (e.g., R&D vs. mass production)?A3: Yes. The ICP Etcher offers flexible transfer platform configurations tailored to specific needs: it can be equipped with manual/ semi-automatic platforms for universities or R&D lines, and fully automated platforms for large-scale mass production lines. This ensures compatibility with small-batch research and high-volume manufacturing alike.

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