IPDB › China Industry › Manufacturing & Processing Machinery › Spraying Machinery & Spreading Equipment
China, Chinese Electron Beam Evaporation Coating Machine with Auxiliary Ion Source1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Spraying Machinery Spreading EquipmentCoatingCoating System
HENAN RUNJING INSTRUMENT EQUIPMENT CO.,LTD
Preview:
Product Description Compact Floor-Standing Vacuum Coating SystemThis user-friendly system features a "flip-top" vacuum chamber for easy operation, suitable for thermal evaporation and sputter deposition of metals, dielectrics, and organic materials.Key Features:Integrated design with the vacuum chamber partially recessed into the support frame.Chamber options: Flip-top lid or bell-jar configuration.Multi-deposition technologies:Thermal evaporation (metals & organics)Low-temperature evaporation (organic films)Magnetron sputtering (metals, oxides, nitrides, insulators)Deposition source layout: Sources mounted at the bottom, substrates at the top (supports wafers up to 6 inches in diameter).Substrate handling: Heating, rotation, and Z-shift adjustment available.Glovebox-compatible: Designed for seamless integration with existing glovebox systems.Deposition Methods Available:Thermal evaporation (metals)Low-temperature thermal evaporation (organics)Magnetron sputtering (metals, oxides, nitrides, insulators)Vacuum Coating System Description (English Version):This system is a popular universal platform in our coating series, featuring a front-opening box-style chamber suitable for multi-source magnetron sputtering, as well as thermal evaporation and electron beam evaporation.Key Features:Integrated design with the vacuum chamber mounted directly on the control system's electronics cabinet.Multi-deposition technologies supported:Thermal evaporation & low-temperature evaporation (for metals and organic materials)Magnetron sputtering (metals, oxides, nitrides, and insulators)E-beam evaporation (compatible with most materials except organics)Flexible source configuration:Deposition sources (thermal, e-beam) typically installed at the bottom.Sputtering sources can also be mounted at the top if required.Substrate handling:Accommodates wafer sizes up to 11 inches.Options include heating, rotation, bias voltage, and Z-shift adjustment.Configurable with planetary sample stages, source shutters, and substrate shutters.Automation options:Ranges from manual thermal evaporation to fully automated process control.Optional fast-loading chamber for rapid sample exchange.Available Deposition Methods:Thermal evaporation (metals)Low-temperature thermal evaporation (organics)Electron beam (e-beam) evaporationMagnetron sputtering (metals, oxides, nitrides, insulators)High-Volume Vacuum Coating SystemKey Features:Tall-chamber design optimized for thermal evaporation, low-temperature thermal evaporation, and e-beam evaporation, featuring extended working distance for superior film uniformityVacuum chamber mounted directly on the control system electronics cabinetIdeal for evaporation techniques requiring longer working distances to achieve optimal uniformityNear-90° evaporation incidence angle enables excellent lift-off performance for photolithographic devicesSupports multi-process deposition:Thermal evaporation (metals)Organic thermal evaporationE-beam evaporationMagnetron sputtering (functioning as a hybrid growth system) Available Deposition Methods:Thermal evaporation (metals)Low-temperature thermal evaporation (organics)Electron beam (e-beam) evaporationMagnetron sputtering (metals, oxides, nitrides, insulators) System Configuration:Ranges from manual thermal evaporation to fully automated process control with multiple growth recipesOptional fast-entry load lock chamber available when neededTop-mounted sample stage accommodates substrates up to 11 inches in diameterAvailable options:Substrate heatingRotationBias voltageZ-shift adjustmentConfigurable with:Planetary sample stageSource shuttersSubstrate shutters**Glovebox-Compatible Thin Film Deposition System****System Overview:**This floor-standing PVD system was specifically developed for glovebox integration, enabling the deposition of air-sensitive thin films. The high-chamber design is ideal for high-performance evaporation processes while maintaining compatibility with magnetron sputtering deposition.**Key Features:**- Designed for deposition of metals, dielectrics, and organic materials- Features a stainless steel box-style vacuum chamber with: - Dual-door design (front and rear) for glovebox integration - Operation access via either the glovebox-connected front door or external rear door- Optimized chamber geometry with high aspect ratio: - Ideal for long working distance evaporation with superior coating uniformity - Compatible with magnetron sputtering configuration- Base vacuum pressure <5×10 mbar- Flexible configuration options to meet varying budgets and requirements- Scalable from manual thermal evaporation to fully automated process control with multiple growth recipes**Deposition Capabilities:**- Thermal evaporation (metals)- Low-temperature thermal evaporation (organics)- Electron beam (e-beam) evaporation- Magnetron sputtering (metals, oxides, nitrides, insulators)**Technical Highlights:**1. The high aspect ratio chamber design provides optimal geometry for both: - Evaporation processes requiring long throw distances - Sputtering applications when configured accordingly2. Dual-door access enables: - Glovebox integration through front door - Conventional loading via rear door3. System maintains ultra-high vacuum compatibility while offering exceptional configuration flexibility**Modular Pilot-Scale Vacuum Coating System****System Concept:**This system introduces modular design principles to pilot-scale production, featuring:- Large chamber volume enabling: - Upscaling of component sizes - Accommodation of large-area coating requirements- Integrated fast-entry load lock chamber for enhanced sample throughput- Fully customizable configuration to meet specific coating requirements**Technical Specifications:**- Floor-standing vacuum deposition system for metals, dielectrics, and organic thin films- Stainless steel box-style chamber with front access door for sample handling- Large chamber volume supports: - Pilot-scale coating applications - Complex experimental configurations- Compatibility with all major deposition components and custom fixtures- Base vacuum pressure ≤5×10 mbar- Flexible configuration options tailored to: - User budgets - Specific application requirements**Available Deposition Methods:**- Thermal evaporation (metals)- Low-temperature thermal evaporation (organics)- Electron beam (e-beam) evaporation- Magnetron sputtering (metals, oxides, nitrides, insulators)**Key Advantages:**1. Modular architecture enables: - Easy component upgrades - Process scalability2. Large chamber dimensions facilitate: - Multiple source configurations - Uniform large-area deposition3. Customizable design supports: - Research and development needs - Small-batch production requirements
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...