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China, Chinese Proximity Switch Laser Trimming Machine Equipped with High Quality Fiber Laser1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Other Laser EquipmentsHi-Precision Laser ResistorTrimming Automation System
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description Product Description Preset the resistor to be trimmed by laser cutting in the proximity switch circuit , and the resistance value will synchronously change with thedistance parameter detected by the proximity switch . A high-speed measurement system is applied to detect the on-off level signals of the proximityswitch in real time when laser trimming the resistor . When the proximity switch outputs the required switch quantity level signal , the laser beamimmediately turns off so as to realize precise adjustment of proximity switch detection distance parameter.System ConstructionThe equipment consists of optical system,laser beam positioning system,vision positioning system,measurement control system,manualplatform,etc.System ParametersProximity Switch Laser Trimming Machine Parameters ConfigurationsHTS600-RHHTS601-RHLaser systemLaser typeFiber laserUV laserCentral wavelength1064nm355nmOutput powe20W3WRepeat frequency30-60kHz20-1000kHzPulse width120-150ns10-100ns Focusing modeManualLaser beam positioningScan range100mm*100mmScan resolution1μmRepeat positioning±1μmPositioning modeCoaxial monitoring systemCoaxial imaging visual positioningLoading/unloading systeLoading/unloading modeManualWork platformMoving platformManual platformMoving range150mm*80mmMeasurement systemProximity switch type3-wire DC PNP/NPN,2-wire DC normally open/closed,2-wire ACDutput voltage signa5V DC,24V DC,220V ACMeasurement signal accessManualApplicationExhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing EquipmentPackaging & Shipping
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