IPDB › China Industry › Manufacturing & Processing Machinery
China, Chinese Semi-Automatic Wafer Splitting Equipment1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Other Laser EquipmentsSplittingWafer
Jiangsu Himalaya Semiconductor Co., Ltd.
Preview:
Product Description Product DescriptionSemiconductor backend process, the wafer non contact splitting process equipment after wafer laser stealth dicing process.Corresponding processing of 4''-12'' wafer productsCorresponding processing of blue tape, UV tapeProduct featuresAdvanced non-contact splitting technology is applied.Manual wafer loading and unloadingvision-assisted wafer position calibrationBidirectional automatic wafer splittingIt is applicable to laser stealth dicing and knife dicing Product ParametersItemGBW900NameSemi automatic Wafer Splitting EquipmentTypeGBW908GBW914GBW912GBW920Wafer size8''6''-8''12''8''-12''wafer typeSilicon WaferWafer thickness≤250μmChip size0.1mm-0.25mmTape typeUV TapeRing type6‘’/8''/12'' Disco Standard RingReserved thickness for dicing5-15μmCapacity30/HPower ConsumptionAC 220v 8AElectrostatic eliminationIon wind rodExhibition & CustomersPackaging & ShippingFAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:Why choose us?A3:OEM/ODM Designing.
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...