IPDB › China Industry › Manufacturing & Processing Machinery
China, Chinese Wafer Bonding Equipment for Hot Pressing Bonding/Eutectic Bonding/Melt Bonding1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Other Laser EquipmentsWafer Bonding EquipmentJyj-200A
Jiangsu Himalaya Semiconductor Co., Ltd.
Preview:
Product Description Product Description JYJ-200AIt is mainly used for SiC seed crystal preparation, high-temperature hot pressing bonding of dissimilar metal materials and nonmetal materials, hot pressing diffusion welding of aluminum alloy components, stainless steel and ceramic materials, as well as wafer level bonding and hot pressing forming process of other powder materials.JYJ-200BIt is mainly used for hot pressing bonding, eutectic bonding, melt bonding, silicon silicon direct bonding, polymer bonding, etc. it has the characteristics of high bonding pressure, good temperature uniformity, uniform pressure, semi-automatic, etc. JYJ-200CIt is mainly used for wafer level packaging of micro systems such as RF, inertial, photoelectric and signal transmission, and wafer level homogeneous heterogeneous bonding of high-end MEMS, highperformance logic devices, engineering substrates and laminated solar cells. It can form bonding interfaces between heterogeneous materials at low temperature and achieve color bonding strength. ApplicationExhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:How to choose a suitable machine?A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...