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China, Chinese Ssx Pecvd Automatic Loading and Unloading Wafer Machine/Quartz Boat Efficient Perc Battery Ald Loading and Unloading Equipment1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Other Laser EquipmentsIntelligent Photovoltaic Transmission AutomationAutomatic Loading and Unloading Machine
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description Product Description G Texturing And Etching Automatic Loading And Unloading MachineUse Of Equipment:Automatic loading of stacked silicon wafers for texturing process Main Technical ParameterCapacity(2 channels):≥ 9600 pcs/hCapacity(2 channels):≥ 14000 pcs/hFragment Rate:≤ 0.02%Power On Rate:≥ 99%Chain Oxidation Automation EquipmentUse Of Equipment:Automatic feeding for chain oxidation processMain Technical ParameterCapacity:≥ 9500 pcs/hFragment Rate:≤ 0.01%Power On Rate:≥ 99% PVD automatic wafer loading and unloading machineUse Of Equipment:Automatic chip loading and unloading for PVD process of hit batteryCapacity:≥ 4000 pcs/hFragment Rate:≤ 0.05% Power On Rate:≥ 99%SSX PECVD Automatic Loading and Unloading Wafer MachineUse Of Equipment:Automatic loading and unloading sheet for tubular PECVD graphite boatCapacity:≥ 5400 pcs/hFragment Rate:≤ 0.04%Power On Rate:≥ 99%Quartz boat loading and unloading machineUse Of Equipment:Automatic loading and unloading of quartz boat for diffusion and annealing processMain Technical ParameterCapacity:≥ 9600 pcs/hFragment Rate:0.03%Power On Rate:≥ 99%Efficient PERC battery ALD loading and unloading equipmentUse Of Equipment:Automatic chip loading and unloading for ALD processMain Technical ParameterCapacity: ≥ 7500 pcs/hFragment Rate: ≤ 0.02%Power On Rate: ≥ 99%ApplicationExhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:How to choose a suitable machine?A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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