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China, Chinese Djj-120 Automatic Chamfering Machine for Semiconductor Wafer1 Industrial Products Supplier Manufacturer Details, price list catalog:
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Other Laser EquipmentsAutomatic Chamfering MachineManufacturing Equipment
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description Product Description Introduction to the MET-5600 Fully Automatic Wafer Chamfering MachineIn the rapidly evolving semiconductor industry, precision and efficiency in wafer processing are critical to maintaining high yields and reducing production costs. The MET-5600 Fully Automatic Wafer Chamfering Machine is a state-of-the-art solution designed to deliver ultra-precise edge profiling for semiconductor wafers, ensuring minimal material loss, superior surface finish, and crystal orientation accuracy.Why Choose the MET-5600?High Precision: Achieves sub-micron edge uniformity, essential for advanced semiconductor applications.Multi-Material Compatibility: Processes silicon (Si), gallium arsenide (GaAs), silicon carbide (SiC), sapphire, bonded wafers, and glass wafers with ease.Automation & Stability: Full CNC control ensures consistent performance, reducing human error and improving throughput.Material Efficiency: Minimizes kerf loss (<0.1%) while maintaining defect-free edges.Compact & Robust Design: Occupies minimal cleanroom space while handling wafers up to 8 inches in diameter.ApplicationsIdeal for semiconductor fabrication, optoelectronics, and MEMS manufacturing, the MET-5600 is engineered to meet the stringent demands of 300mm fabs, R&D labs, and compound semiconductor production. Whether processing SiC for power devices or GaAs for photonics, this machine ensures repeatable, high-quality results.By integrating smart sensing, automated alignment, and real-time process monitoring, the MET-5600 guarantees efficiency and reliability-future-proofing your wafer edge preparation process. Technical Performance TableParameterSpecificationGrinding PrecisionSub-micron level edge uniformityMaterial Loss Rate<0.1% (optimized for minimal kerf loss)Orientation Accuracy±0.1° crystal alignmentThroughputAdjustable based on wafer material/hardnessAutomation LevelFull CNC control with robotic wafer handling (optional)Cooling SystemIntegrated DI water/spray cooling to prevent thermal stressCompliance StandardsSEMI/SECS/GEM compliance for fab integrationChamfering machine is one of the key equipment used in semiconductor chip preparation process, responsible for grinding irregular shaped chip contours into standard wafers, and high-precision CNC grinding chamfering machine for grinding the periphery and sides of the chip. MET-5600 Automatic Wafer Chamfering Machine - Key FeaturesAttributeSpecificationEquipment TypeFully automatic wafer edge chamfering/grinding machineCompatible Wafer Sizes4-inch, 6-inch, 8-inch diametersSupported MaterialsSilicon (Si), Indium Phosphide (InP), Gallium Arsenide (GaAs), Silicon Carbide (SiC), Sapphire, Bonded Wafers, Glass WafersMachine Dimensions2.2 m (L) × 1.5 m (W) × 2.2 m (H)Weight3 tonsKey AdvantagesHigh precision, minimal material loss, stable operation, accurate crystal orientation positioning, superior surface finishTypical ApplicationsSemiconductor wafer edge profiling, post-cutting chamfering, defect-free edge finishing ApplicationExhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:How to choose a suitable machine?A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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