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China, Chinese Epoxy/Eutectic/Die Bonding Machine for Advanced Semiconductor Packaging and Assembling1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterDie Bonding MachineBonding Machine
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product DescriptionDie Attach MachineThe DA801 IC Linear High-Speed Die Attach Machine is a fully automatic wafer die bonder designed for high accuracy and efficiency in semiconductor packaging. It features a dual dispensing system, high-precision linear-driven bond head, and a highly accurate die rotation system. With support for 6" to 8" wafers and customizable options, it ensures precise die placement and versatile compatibility for various applications.SpecificationWafer sizeMultifunctional work tableIntelligent control systeml Wafer size: 6"- 8"l Dual dispensing systeml High-precision linear driven bond headl Support DAF functionl Multifunction work table, suitable for different kinds of lead frames & substratesl High-precision wafer table with highly accurate die rotation system and motorized wafer expansion systeml Intelligent dispensing control system to realize precision glue volume controll Missing die detection and re-picking functionl Customization for special design is also available.Die Bonding Machine ParamaterSystemCycle time230msPerformanceX/Y placement accuracy±10-25μm@3sigmaTheta placement accuracy±1°@3sigmaMaterials HandlingDie size0.15x0.15mm - 25x25mmDie thickness0.076 - 1 mm (Standard), Thinnest: 0.05 mm (Optional)Substrate dimensionsLength: 100-300mm; Width: 40-100mm; Thickness: 0.1-0.8mm (Standard), 0.8-2.0mm (Optional)Magazine dimensions110-310mm x 20-110mm x 70-153mm (Length x Width x Height)Wafer SystemWafer size6" - 12"Auto-theta alignment±10° RangeTheta360°Bond Head SystemBond force20 - 500 g (Programmable)Workholder SystemTrackwidth40 - 100 mm (Customizable)Pattern RecognitionPR systemMulti-colorResolution1920pixel x 2560 pixel (Customizable)Pixel & FOV5M (1920x2560 pixel)Angular accuracy±0.1°Dimensions & WeightDimension2250 x 1650 x 1750 mm (Length x Width x Height)Weight1600kgCompany ProfileJiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Highly AutomatedAutomatic ControlHighly automatedHigh intelligence. Equipped with fully automatic feeding and discharging magazine processing system that supports SEMI online communication protocol and SECS / GEM protocol high intelligence, Automatic glue volume and bond placement compensation based on inspection system.Force control mechanism: High precision force control system uses voice coil to control the bonding pressure.Bond force adjustability: The bond force is programmable to vary from 30 to 500g.User - interface: Friendly operation interface that supports EPOXY IQC and POST IQC graphic display.Pattern Recognition SystemSmart SystemPattern Recognition SystemResolution: 640 x 480pixel (Customization)Color - capability: Multi - colorAngular accuracy: ± 0.1 degreesIntelligence: Highly intelligent vision system that supports automatic inspection of glue volume, shape, position and post - bonding.Force control mechanism: High precision force control system uses voice coil to control the bonding pressure.Bond force adjustability: The bond force is programmable to vary from 30 to 500g.User - interface: Friendly operation interface that supports EPOXY IQC and POST IQC graphic display.Die Bonding Mahcine Application1. Primary Semiconductor Packaginga) IC AssemblyChip-on-Leadframe (COL): Attach dies to metal leadframes (e.g., QFP, SOP packages) using epoxy/Ag paste.Flip-Chip Bonding: Precision placement of bumped dies onto substrates (Cu pillars, solder bumps).System-in-Package (SiP): Stack multiple dies (logic + memory) in a single package with adhesive/thermal interfaces.b) Power ElectronicsMOSFET/IGBT Modules: Bond SiC/GaN dies to DBC substrates with silver sintering (high-temperature reliability).Automotive Modules: Die attach for inverters, EV battery management systems (conductive adhesives preferred). 2. Optoelectronics & SensorsLED Packaging: Mount LED chips on ceramic/Al substrates (high-accuracy placement for uniform luminescence).MEMS Sensors: Glue-bond accelerometers/gyroscopes with low-outgassing adhesives (avoiding cavity contamination).Lidar/Photonic ICs: Align laser dies to waveguides with sub-μm precision (active optical alignment compatible). 3. Advanced Packaginga) Fan-Out Wafer-Level Packaging (FO-WLP)RDL-First Processes: Place known-good dies on temporary carriers with thermocompression bonding.Chiplet Integration: Heterogeneous die stacking (e.g., CPU + HBM) using TCB/NCF (non-conductive film).b) 3D-IC & TSV StacksDie-to-Wafer Bonding: Stack DRAM dies with micro-bumps (hybrid bonding for <1μm misalignment).Interposer Assembly: Bond dies to Si interposers with underfill dispensing (Cu-Cu direct bonding for HPC). 4. Emerging ApplicationsFlexible Electronics: Bond thin-film ICs to polyimide substrates (low-force placement to avoid cracks).Medical Implants: Hermetic die sealing for bio-sensors (biocompatible adhesives like Parylene).CertificationsISO 9001PatentPatent2015 Certified ProductionAsk our sales for detailsAsk our sales for detailsCertificationsWe are an ISO 9001-certified manufacturer and innovator specializing in semiconductor equipment, with 6 registered utility model patents (UM Patents) in China. Our patented technologies cover:Semiconductor annealing systemsCleaning equipment for semiconductor etchingUV debonding machinesAnd more .Backed by ISO 9001 quality management, we ensure high precision, reliability, and efficiency in semiconductor manufacturing processes. Our R&D-driven solutions enhance production yield and cost-effectiveness for global clients in IC packaging, MEMS, and advanced wafer processing.Partner with us for cutting-edge, patent-protected semiconductor equipment tailored to your needs.FAQ1. What is a die bonding machine?A: A precision assembly tool that attaches semiconductor dies (chips) to substrates/leadframes using adhesives, solder, or thermo-compression. Critical for IC packaging, power electronics, and advanced 3D-IC integration.Key Subtypes:Epoxy Die Bonders: Use conductive/non-conductive adhesives.Eutectic Bonders: Au-Si or solder-based high-temperature bonding.Flip-Chip Bonders: For bumped dies with μm-level alignment. 2. What accuracy can modern die bonders achieve?A: Standard: ±5μm (for QFN, SOP packages).High-Precision: ±0.5μm (flip-chip, photonics).Ultra-High: <0.1μm (hybrid bonding for 3D-IC).Factors Affecting Accuracy:Vision systems (CCD/IR alignment).Stage motion control (linear motors vs. steppers).Environmental vibration isolation.
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