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China, Chinese Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterDie BonderFlip Chip Die Bonder
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product DescriptionFlip chip die bonderDA1201FC Flip Chip and Die AttachX/Y placement accuracy:Flip-chip/high-precision die attach mode: ±10-15μm@3σ;Die attach mode: ±10-25μm@3σ;Specially designed for flip chip devices with low pin count, DA1201FC provides a fully automatic high-speed flip chip solution for various devices, such as SOIC, SO, QFN, BGA, LGA, etc. At the same time, it is equipped with die attach system;High-speed and high precision die bonding capability;MS Windows? operating system and flexible connectivity;Flip chip and die bonding in one machine - the conversion between the two processes is simple and easy;Comprehensive inspection system;High density lead frame handling capability.SpecificationItemDA1201FCFlip Chip/High PrecisionDie Attach ModuleX/Y placement accuracy±10-15μm @3oTheta placement accuracy5mm≤Diesize≤10mm ±0.15°@3o;1mm≤Diesize≤5mm ±0.3°@3o;0.25mm≤Diesize≤1mm ±1°@3oDie Attach Modulex/Y placement accuracy±10-25μm @3oTheta placement accuracyDie size≥1mm ±0.5°@3o;Die size≤1mm ±1°@3oMaterialsHandlingCapabilityDie size0.15x0.15mm-6x6mmSubstrate dimensionsLength:100-300mm;width:40-100mm;Thickness:0.1-0.8mm(Standard)0.8-2.0mm (Optional)Magazine dimensions110-310mmx20-110mmx70-153mm(LengthxWidthx HeightWafer SystemWafer size6"-12"Auto-theta alignment±10°RangeTheta360°Bond Head SystemBond force20-1000 g(ProgrammablePatternRecognitionSystemPR systemMulti-colorResolution1280pixelx640 pixel(Customizable)Pixel&FOV±1/4pixel (±lum@FOV2mm)Angular accuracy0 . 1°Dimensions&WeightDimension2250x1650×1750 mm(LengthxWidthxHeight)Weight1600kgPacking & DeliveryWooden pack with air-freight, sea-freight or express serviceCompany ProfileJiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd. is a premier semiconductor equipment manufacturer and global exporter established in 2019. We specialize in providing high-performance, cost-effective semiconductor manufacturing solutions to clients worldwide, with a strong presence in 30+ countries and a network of 200+ satisfied customers and suppliers.We design and manufacture advanced semiconductor production equipment, including:Die Bonders – High-precision chip attachment for IC packagingWire Bonders – Reliable interconnects for semiconductor devicesLaser Processing Machines – Wafer marking, grooving, cutting (Si, SiC, glass, ceramics)FAQQ1: Does it work with phone cases?A: Yes! Charges through cases up to 8mm thick (plastic, silicone, or TPU).Q2: Why does my device charge slowly?A: Ensure your phone supports 15W wireless charging. Lower power may apply for non-Qi devices.Q3: How do I claim warranty service?A: Email your order ID and issue description to ***@***.com. We’ll respond within 24 hours.
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