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China, Chinese Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine / Die Attach1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterDie AttachDie Bonder
Guangzhou Minder-Hightech co.,Ltd
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Product Description Since 2014,One-stop Professional Solution for Semiconductor Front-end and IC TO Package Equipments LineProduct DescriptionAutomatic loading and unloading crystal fixing machineFully automatic loading and unloading, suitable for SMD, 1W and integrated high-power COB surface light source, triode and other flat support productsModular design, new optimized layout, focus on quality, with the best stable performanceYou can flexibly choose different configurations such as four crystal rings, double dispensing heads, double glue plates, 25cm long brackets, etc., to create the most suitable products for customersBrand-new tying head design, fast die bond cycle up to 180msPatented head binding, accurate positioning and more stable operation;5mil small chip processing capacityDesign a variety of chip search methods, suitable for the search of various shapes of wafersUltra-long PIN (65ms) processing capability to meet different customer needsSpecification360-8 inch wafer bonding machine technical specificationsSolid crystal workbench (linear module)Optics SystemWorkbench stroke450x220mmCameraResolution1μmOptics Magnifier0.7 times ~ 4.5 timesEpistar Workbench (Linear Module)Cycle Time200MS/EAXY stroke8"*8"Die bond cycleLess than 250 millisecondsResolution1μmProduction capacityGreater than 12kAccuracy of wafer placementLoading and unloading moduleManual loading and unloadingStick position x-y±2mil Rotation accuracy±3°Dispensing moduleEquipment RequireUse swing arm dispensing + heating systemVoltageAC220V/50HZThe dispensing needle group can be interchanged with single needle or multiple needlesAir SourceAt least 6BARVacuum Source700mmHGPower Consumpion3000wPR SystemDimensions And WeightMethod256 grey levelsWeight450kgDetectionInk/chipping/cracked dieSize(DxWxH)1200*900*1500mmMonitor17" LCD Monitor Resolution1024*768Missing DieVacuum Sensor 380-12 inch wafer bonding machine technical specificationsSolid crystal workbench (linear module)Optics SystemWorkbench stroke100x300mmCameraResolution1μmOptics Magnifier0.7 times ~ 4.5 timesEpistar Workbench (Linear Module)Cycle Time200MS/EAXY stroke12"*12"The die bonding cycle is less than 250 milliseconds, and the production capacity is greater than 12k;Resolution1μmAccuracy of wafer placementLoading and unloading moduleStick position x-y±2milAutomatic feeding method using vacuum suction cupUnloading using the material box container type receiving materialUse pneumatic pressure plate type clamp, the width of the bracket can be adjusted in the range of 25~90mmRotation accuracy±3° Dispensing moduleEquipment RequireUse swing arm dispensing + heating systemThe dispensing needle group can be interchanged with single needle or multiple needlesVoltageAC220V/50HZAir SourceAt least 6BARVacuum Source 700mmHG(Vacuum pump)Power Consumpion3000wPR SystemDimensions And WeightMethod256 grey levelsWeight450kgDetectionink /chipping/cracked dieSize(DxWxH)1200*1200*1500mmMonitor17" LCD Monitor Resolution1024*768 Bonding armBonding arm90 degreeMotorAC servo motoWafer work stageStroke6"*6"resolution0.2 mil (5μm)Lead frame wore stageLead frame number1PCStroke10"*6"Resolution0.2 mil (5μm)Die and waferDie dimension5mil*5mil~100mil*100milWafer dimension66 :±3°:±1.5mil 25g~35g Ejector system Sync with the part Can adjust the height Epoxy picking systemEpoxy picking armRotary typemotoAC servo motoProduct detailsSampleFrequently Asked Questions1. About Price:All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.2. About Sample:We can provide sample production services for you, but you may provide some fees.3. About Payment:After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.4. About Delivery:After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.5. Installation and Debugging:After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.6. About Warranty:Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
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