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China, Chinese Factory Price Automatic Die Attach IC Assembly and Packaging Die Bonding Equipment1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterDie BonderDie Attach Machine
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product DescriptionDie BonderThis series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die bonding machine in the world. Its production capacity and accuracy have reached the same level as imported equipment from Europe and the United States. The advanced gas-heat track structure design leads the industry in oxygen content control. The wafer stage, XY die bonding, and double-drawing tin system of the SD800/PLUS/+ models are designed in a straight line to provide high-quality quality control for your products.SD800 is mainly used for single-row lead frame packages, such as TO263 & TO220 & TO247 & TO3P, etc.SD800 supports tinning/writing/pressing functions.Supports Map function.SD800 track width up to 70mmSpecificationApplicationsKey Applications of Die BondingIntegrated Circuit (IC) PackagingPower ElectronicsMEMS & SensorsRF & Microwave DevicesAdvanced Packaging TechnologiesKey ConfigurationsUltra-Precise, High-Speed Bonding3,000–5,000 UPH – Optimized for dot/press soldering and lead frames.±70 μm Accuracy – Tight tolerances (<1° tilt, ≤5% void rate) for reliability.Smart & Scalable – AI-assisted alignment, multi-machine linking, GSM remote monitoring.Flexible Configurations – Robotic/conveyor loading, solder path programming, 8-zone temp control.Technical SpecificationsCategorySD800 SpecificationsUnitEX400Core Performance45,000ModelSD800-220UPH (Units Per Hour)3,000-5,000 (depends on process: dot soldering, press soldering + single-row lead frame)pcs/hour1.8–2.5MTBAOptimized pattern recognition reduces downtime-8.8Process Control13.6Solder Thickness1-3mil600Wafer Tilt Tolerance<1° for chips ≤150 × 150 mil; stricter for larger chips°Soft Solder Void RateSingle void ≤2%; Total area ≤5%%Soft Solder Coverage100% (chip-to-pad edge >10 mil)%XY Soldering Accuracy±27 mil (70 μm), ±2°μm/°Mechanical DesignTrack Width70mmSoldering HeadStandard (upgradable to linear-control high-precision head)-Track Temp. Control8-stage independent zones-Oxygen ControlUltra-low oxygen (<50 ppm)ppmOptional FeaturesLoading MethodsRobotic arm/conveyor multi-mode-Machine LinkingConnect 2 same-model units-Smart FunctionsMAP algorithm support / Optional GSM module-Wafer Disc StructuresMultiple configurable types (model-specific)-Solder Path ProgrammingMulti-mode trajectory planning-ApplicationKey Applications of Die BondingIntegrated Circuit (IC) PackagingFlip-Chip Bonding: High-density interconnects in CPUs, GPUs, and advanced ICs.Wire-Bonded Packages: Traditional die attachment in QFPs, BGAs, and DIPs.3D IC Stacking: Enables vertical integration for memory (HBM) and processors.Power ElectronicsAutomotive (EVs, IGBTs): Reliable die attach for power modules in inverters and converters.LED & Laser Diodes: Efficient thermal management for high-brightness LEDs and optoelectronics.SiC/GaN Devices: High-temperature bonding for next-gen wide-bandgap semiconductors.MEMS & SensorsMEMS Gyroscopes/Accelerometers: Precision bonding for automotive and IoT sensors.Pressure & Temperature Sensors: Robust attachment for industrial and medical devices.RF & Microwave Devices5G & mmWave Components: Low-loss bonding for RF amplifiers and filters.Aerospace/Defense Electronics: High-reliability bonding for radars and satellite systems.Advanced Packaging TechnologiesFan-Out Wafer-Level Packaging (FOWLP): High-density interconnects for mobile processors.System-in-Package (SiP): Multi-chip integration for wearables and IoT devices.After Sales ServiceStandard Warranty: 12 months or 2,000 operating hours (whichever comes first).Extended Warranty: Optional coverage up to 36 months.Global Support: 24/7 technical assistance and spare parts supply.Training: On-site or remote operation/maintenance training.Company ProfileJiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd. is a premier semiconductor equipment manufacturer and global exporter established in 2019. We specialize in providing high-performance, cost-effective semiconductor manufacturing solutions to clients worldwide, with a strong presence in 30+ countries and a network of 200+ satisfied customers and suppliers.Our Core Semiconductor EquipmentWe design and manufacture advanced semiconductor production equipment, including:Die Bonders – High-precision chip attachment for IC packagingWire Bonders – Reliable interconnects for semiconductor devicesLaser Processing Machines – Wafer marking, grooving, cutting (Si, SiC, glass, ceramics)Wafer Dicing Saws – Precision cutting for MEMS, optoelectronics, and advanced packagingLaser Annealing Systems – For Si/SiC wafersAutomatic Dispensing Equipment – High-accuracy silicone & epoxy applicationWhy Choose Us?Other ProductsGlobal Reach – Trusted by 200+ clients in 30+ countrieEnd-to-End Support – From procurement to integrationCutting-Edge Technology – Precision-engineered for high yield & efficiencyCustomization – Tailored solutions for unique production needsWire BondingSilicone dispensing machineWafer dicingWafer markingLaser cutting etcFAQQ: What's the lead time for orders?A: Standard models ship in 15–30 days; customized units require 30–45 days.Q: Do you provide after-sales service overseas?A: Yes, we have partnered service centers in key regions.Q: Can I request a customized size?A: Absolutely! We offer tailored attachments.Q: What documents do you provide for export?A: Full export package (Commercial Invoice, Packing List, Bill of Lading, COC, etc.).Q: How do I place an order?A: Contact us via email/phone for a quote, then confirm with a PO.
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