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China, Chinese Micro Scale Gantry Dispensing Dispenser and Die Bonder Die Bonding Eutectic Crystal Planting Machine Die Mounter1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterDie Mounting MachineDie Bonding Machine
Guangzhou Minder-Hightech co.,Ltd
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Product Description Fully automatic high-precision Dispensing Machine and Die bonding machineThe fully automatic high-precision Dispensing Machine and Die bonding machine are key equipment for post packaging that can be combined online, with a positioning accuracy of+/-3um.The machine adopts advanced motion control technology and modular design concept, with flexible and diverse configuration methods, suitable for multi chip bonding, providing flexible and fast solutions for microwave and millimeter wave fields, hybrid integrated circuit fields, discrete device fields, optoelectronics and other fields.Function:1. Programming is convenient, easy to learn, and effectively shortens the training cycle for personnel2. For white ceramics, substrates with grooves, etc., the one-time success rate of image recognition is high, reducing manual intervention3. 12 suction nozzles and 24 gel boxes can meet the mounting requirements of most microwave multi chip users4. Real time monitoring of the current device's working status, material situation, nozzle application, etc. through the second display;5. Automatic dispensing, automatic SMT station, free combination, multiple cascading machines, effectively improving production;6. Multi program combination mode, which can quickly call existing subroutines7. High precision exploration can reach 1um8. Equipped with precision dispensing control and calibration device, the minimum glue point diameter can reach 0.2mm9. Efficient mounting speed, with a production capacity of over 1500 components per hour (taking 0.5 * 0.5mm size as an example)Sample:For patch platform:NO.Component nameIndex nameDetailed indicator description1Motion platform Movement strokeXYZ-250mm*320mm*50mmSize of products that can be mountedXYZ-200mm*170mm*50mmDisplacement resolutionXYZ-0.05umRepeat positioning accuracyXY axis: ±2um@3SZ axis: ±0.3umMaximum running speed of XY axisXYZ=1m/sLimit functionElectronic soft limit + physical limitRotation range of rotation axis θ±360°Rotation resolution of rotation axis θ0.001°Probing height method and accuracyMechanical height detection, 1umOverall accuracy of patchPatch accuracy ±3um@3SAngle accuracy ±0.001°@3S2Force control systemPressure range and resolution5~1500g, 0.1g resolution3Optical systemMain PR camera4.2mm*3.7mm field of view, support 500M pixelsBack recognition camera4.2mm*3.7mm field of view, support 500M pixels4Nozzle systemClamping methodMagnetic + vacuumNumber of nozzle changes12Auto-calibration and auto-switching of nozzlesSupport online automatic calibration, automatic switchingNozzle detection protectionSupport5Calibration systemBack view camera calibrationNozzle XYZ direction calibration 6Functional featuresProgram compatibilityProduct images and location information can be shared with the dispensing machineSecondary identificationPossessing secondary recognition function for substratesMulti-layer matrix nestingPossessing multi-layer matrix nesting function for substratesSecond display functionVisually view material production status informationSwitch of individual points can be set arbitrarilyCan set the switch of any component, and the parameters are independently adjustableSupport CAD import function Product cavity depth12mmSystem connectionSupport SMEMA communication7Patch moduleCompatible with patches at different heights and angles The program automatically switches nozzles and components The chip picking parameters can be modified independently/in batchesThe chip picking parameters include the approach height before chip picking, the approach speed of chip picking, the pressure of chip picking, the height of chip picking, the speed of chip picking, the vacuum time and other parametersThe chip placement parameters can be modified independently/in batchesThe chip placement parameters include the approach height before chip placement, the approach speed before chip placement, the pressure of chip placement, the height of chip placement, the speed of chip placement, the vacuum time, the backflush time and other parametersBack recognition and calibration after chip pickingIt can support the back recognition of chips in the size range of 0.2-25mmChip position center deviationNo more than ±3um@3SProductivity efficiencyNo less than 1500 components/hour (taking the chip size of 0.5*0.5mm as an example)8Material systemCompatible number of waffle boxes/gel boxesStandard 2*2 inches 24 piecesEach box bottom can be vacuumed Vacuum platform can be customizedVacuum adsorption area range can reach 200mm*170mmCompatible chip sizeDepends on the tip matchingSize: 0.2mm-25mmThickness: 30um-17mm9Equipment safety and environmental requirementsAir systemDevice shapeLength*depth*height: 840*1220*2000mmDevice weight760KgPower supply220AC±10%@50Hz,10ATemperature and humidityTemperature: 25oC±5oCHumidity: 30%RH~60%RHCompressed air source (or nitrogen source as an alternative)Pressure>0.2Mpa, flow>5LPM, purified air sourceVacuumPressure<-85Kpa, pumping speed>50LPMFor dispensing platformN0.Component nameIndex nameDetailed indicator description1 Motion platformMovement strokeXYZ-250mm*320mm*50mmSize of mountable productsXYZ-200mm*170mm*50mmDisplacement resolutionXYZ-0.05umRepeat positioning accuracyXY axis: ±2um@3SZ axis: ±0.3umMaximum operating speed of XY axisXYZ=1m/sLimit functionElectronic soft limit + physical limitRotation range of rotation axis θ±360°Rotation resolution of rotation axis θ0.001°Probing height method and accuracyMechanical height detection, 1um, the height detection of any point can be set;Overall dispensing accuracy±3um@3S2Dispensing moduleMinimum glue dot diameter0.2mm (using 0.1mm diameter needle)Dispensing modePressure-time modeHigh-precision dispensing pump, control valve, automatic adjustment of positive/negative dispensing pressure Dispensing air pressure setting range0.01-0.6MPaSupport dotting function, and parameters can be set arbitrarilyParameters include dispensing height, pre-dispensing time, dispensing time, pre-collecting time, dispensing pressure and other parametersSupport glue stripping function, and parameters can be set arbitrarilyParameters include dispensing height, pre-dispensing time, glue speed, pre-collecting time, glue pressure and other parametersHigh compatibility of dispensingIt has the ability to dispense glue on planes at different heights, and the glue type can be rotated at any angleCustom glue strippingThe glue type library can be directly called and customized3Material systemVacuum platform can be customizedVacuum adsorption area range up to 200mm*170mmGlue packaging (standard)5CC (compatible with 3CC)Pre-marked glue boardCan be used for parameter height of dotting and glue-scribing mode, and pre-scribing before glue-dispensing production4Calibration systemGlue needle calibrationCalibration of glue-dispensing needle XYZ direction5Optical systemMain PR camera4.2mm*3.5mm field of view, 500M pixelsIdentify substrate/componentCan normally identify common substrates and components, and special substrates can be customized with recognition function6Functional featuresProgram compatibilityProduct images and location information can be shared with the placement machineChip position center deviationNo more than ±3um@3SProductivity efficiencyNo less than 1500 components/hour (taking 0.5*0.5mm chip size as an example)Secondary identificationHas substrate secondary recognition functionMulti-layer matrix nestingHas substrate multi-layer matrix nesting functionSecond display functionVisually view material production status informationSwitch of individual points can be set arbitrarilyCan set the switch of any component, and the parameters are independently adjustableSupport CAD import function Product cavity depth12mm7Equipment safety and environmental requirementsGas systemEquipment shapeLength*depth*height: 840*1220*2000mmEquipment weight760KgPower supply220AC±10%@50Hz, 10ATemperature and humidityTemperature: 25oC±5oCCompressed air source (or nitrogen source as an alternative)Humidity: 30%RH~60%RHVacuumPressure>0.2Mpa, flow>5LPM, purified air sourceProduct Details:Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. FAQ1. About Price:All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.2. About Sample:We can provide sample production services for you, but you may provide some fees.3. About Payment:After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.4. About Delivery:After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.5. Installation and Debugging:After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.6. About Warranty:Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
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