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China, Chinese Semiconductor Wafer Packaging Welding Equipment Laser Vision Micro Desktop Automatic Solidification Machine Die Bonder Bonding1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterDie AttachDie Bonder Bonding
Guangzhou Minder-Hightech co.,Ltd
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Product Description Full-Function Desktop Automatic Die Bonding MachineThe Full-Function Desktop Automatic Die Bonding and Placement System is a comprehensive laser vision-based micro-assembly solution for high-precision die bonding. It effectively addresses user demands for compact footprint and high-precision processes. With a modular design, flexible configuration, and easy operation, the core module integrates a high-precision force-controlled mounting system and a dispensing fixture system. The system uses a micron-level gantry structure with single and dual drives, allowing easy integration with other modules for various configurations.This system is widely used in various fields, including electronic devices (Micro LED, mini LED display chips, next-generation mobile devices with 03015 and 008004 components, large medical equipment (core imaging module assembly), optical devices (laser LD Palladium bar assembly, VCSEL, PD, LENS, etc.), and semiconductors (MEMS devices, RF devices, microwave components, and hybrid circuits).Key FeaturesDesktop High-Precision Multi-Function Placement and Dispensing PlatformAI Flatness Calibration System on the placement and dispensing platform, greatly reducing issues such as voids in die bonding.Precision Force-Controlled Soft Landing System: Ensures minimal contact force, preventing damage to the chip or leaving marks on it, perfectly solving defects caused by traditional pneumatic control systems and improving throughput.Supplementary Modules: Features automatic needle adjustment (fully automated calibration) and automatic needle tip change (supports 2-3 types of products), with auto calibration completed in less than 3 minutes.High-Precision Bonding for Small-Batch Production and Experiments: Meets the needs of both high-precision experimental bonding and small-batch production.ProjectContentSpecificationPlatform SystemX-Axis Stroke300mmY-Axis Stroke300mmZ-Axis Stroke50mmT-Axis Stroke360°Mounting Device Size0.15-25mmTooling Range180*180mmXY Drive TypeServoMaximum XY Running SpeedXYZ = 50mm/sLimit FunctionElectronic soft limit + physical limitLaser Height Measurement Precision3μmNeedle Calibration Module Accuracy3μmPlatform StructureDual Y optical platformPlacement SystemOverall Placement Accuracy±10μmAdhesive Force Control10g-80gPlacement OrientationDifferent heights, different anglesSuction NozzlesBakelite suction nozzle / rubber suction nozzlePlacement Pressure0.01N-0.1N (10g-100g)Production EfficiencyNot less than 180 components/hour (for 0.5mm x 0.5mm chip size)Dispensing SystemMinimum Dispense Dot Diameter0.2mm (using 0.1mm aperture needle)Dispensing ModePressure-time mode (standard machine)High-Precision Dispensing Pump and Control ValveAutomatically adjustable positive/negative pressure based on the path feedbackDispensing Air Pressure Range0.01-0.5MPaSupport for Dot Dispensing FunctionParameters can be set freely (including dispensing height, pre-dispense time, dispensing time, pre-retract time, dispensing air pressure, etc.)Support for Scraping FunctionParameters can be set freely (including dispensing height, pre-dispense time, scraping speed, pre-retract time, scraping air pressure, etc.)Dispensing Height CompatibilityCapable of dispensing at different heights, with the adhesive shape adjustable to any angleCustomizable ScrapingAdhesive library can be directly accessed and customizedVision SystemXY Repetition Positioning Accuracy5μmZ Repetition Positioning Accuracy5μmUpper Vision System Resolution3μmLower Vision System Resolution3μmNeedle Contact Sensor5μmProduct ApplicabilityDevice TypesWafer, MEMS, Infrared Detectors, CCD/CMOS, Flip ChipMaterialsEpoxy resin, silver paste, thermal conductive adhesives, etc.External DimensionsWeightApprox. 120KGDimensions800mm × 700mm × 650mm (approx.)Environmental RequirementsInput Power220AC ± 5%, 50Hz, 10ACompressed Air (Nitrogen) Supply0.2MPa ~ 0.8MPaTemperature Environment25°C ± 5°CHumidity Environment30% RH ~ 60% RHMinder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. FAQ1. About Price:All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.2. About Sample:We can provide sample production services for you, but you may provide some fees.3. About Payment:After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.4. About Delivery:After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.5. Installation and Debugging:After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.6. About Warranty:Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
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