IPDB › China Industry › Manufacturing & Processing Machinery
China, Chinese Automatic High Speed Epoxy Die Bonder Machine Manufacturer1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterDie Bonder MachineDie Bonding Rubber Tool
Jiangsu Himalaya Semiconductor Co., Ltd.
Preview:
Product Description Fully Automatic Die Bonding Machine System manufacturerProduct DescriptionThis is a fully automatic silver paste die bonding machine. It combines ultra-high speed and high precision. It is suitable for general IC and discrete devices. It is suitable for wafers up to 12 inches. With an excellent dispensing control system, this fully automatic high-speed silver paste die bonding machine is your absolute first choice.Leading production capacity: 20000UPHExcellent accuracy: ±20μm@3σHigh-density lead frame processingPrecision-controlled dispensing systemUniversal track design for a variety of packagesCompound feeding (optional)Detailed PhotosProduct ParametersSpecificationUPH: 20000XY Placement Accuracy: ± 20 μm @ 3σChip RotationDie size:>1x1mm, ± 0.2° @ 3σDie size:<1x1mm, ±1@3σMaterial Handling CapabilityChip SizeStandard: (0.25 x 0.25- 14 x 14 mm2)Frame SizeLength: 100-300 mmWidth: 15-100 mmThickness: 0.1-0.8 mmCassette SizeLength: 110-310 mmWidth: 20-110 mmHeight: 70-153 mmWelding head systemWelding head force: 30- 300 g (programmable)Wafer systemWafer size: 12~8 inches Exhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonding,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment. Packaging & ShippingFAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:Why choose us ?A3:OEM/ODM/Designing.
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...