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China, Chinese Original Factory Direct Price Automatic Semiconductor Equipment Die Bonding Machine1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterDie Bonding MachineDie Bonding Price
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description Fully Automatic Die Bonding Machine System manufacturerProduct DescriptionThis series of soft solder die bonding machines is the most accurate and fastest 8-inch (downward compatible with 6-inch) soft solder die bonding machine in the world. Its production capacity and accuracy have reached the same level as imported equipment from Europe and the United States. The advanced gas-heat track structure design leads the industry in oxygen content control. The wafer stage, XY die bonding, and double-drawing tin system of the SD800/PLUS/+ models are designed in a straight line to provide high-quality quality control for your products.SD800 is mainly used for single-row lead frame packages, such as TO263 & TO220 & TO247 &TO3P, etc.SD800 supports tinning/writing/pressing functions.Supports Map function.SD800 track width up to 70mm Detailed Photos Product ParametersCategorySD800 SpecificationsUnitCore Performance ModelSD800-UPH (Units Per Hour)3,000-5,000 (depends on process: dot soldering, press soldering + single-row lead frame)pcs/hourMTBAOptimized pattern recognition reduces downtime-Process Control Solder Thickness1-3milWafer Tilt Tolerance<1° for chips ≤150 × 150 mil; stricter for larger chips°Soft Solder Void RateSingle void ≤2%; Total area ≤5%%Soft Solder Coverage100% (chip-to-pad edge >10 mil)%XY Soldering Accuracy±27 mil (70 μm), ±2°μm/°Mechanical Design Track Width70mmSoldering HeadStandard (upgradable to linear-control high-precision head)-Track Temp. Control8-stage independent zones-Oxygen ControlUltra-low oxygen (<50 ppm)ppmOptional Features Loading MethodsRobotic arm/conveyor multi-mode-Machine LinkingConnect 2 same-model units-Smart FunctionsMAP algorithm support / Optional GSM module-Wafer Disc StructuresMultiple configurable types (model-specific)-Solder Path ProgrammingMulti-mode trajectory planning- Exhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd.Was established in 2019, mainly engaged in exporting business and integration of semiconductor industry equipment.The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers,aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!We manufacture equipments for Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine(Wafer Packaging), Automatic Silicone Dispensing Equipment.As well as we provide some solutions for handling exhausted metal sorter equipments, customized coating and plating machine, TGV & manual/semiautomatic/automatic equipments, so on. Packaging & ShippingFAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:Why choose us ?A3:OEM/ODM/Designing.
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