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China, Chinese Equipment Factory Rapid Wire Bonding Machine for Production Line1 Industrial Products Supplier Manufacturer Details, price list catalog:
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Chip MounterWire Bonding MachineDie Bonding Rubber Tool
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description Equipment factory Rapid wire bonding machine for production lineProduct DescriptionTechnical Specifications:Wire Bonding CapabilityUltra-fine Pitch Gold Wire Bonding: 35 μm Inline Bond Pad PitchWire Diameter: 0.6 mil to 2.5 mil Copper, Silver or GoldNote:Gas shield is required for copper or silver wire bondingWires with diameters greater than 2.0 mil require thick wire toolsDetailed PhotosProduct ParametersSpecificationBonding areaX-axis: 56 mmA-axis: 80 mm (standard), 87 mm (enlarged), 90 mm (extra large)Total Bonding Accuracy2.0 μm @ 3 sigmaPattern RecognitionAdvanced Vision Scanning EngineCCD Camera· 2x Vision Magnification (2x & 6x)·Programmable High-power Magnifier FocusAdvanced Process CapabilitiesCompatible with Traditional ProcessesProBond, ProStitch Stranding ProcessAdvanced Wire Bonding and Low-arrest Consistency of the Power SeriesCompatible with Standard Processes of All Existing ModelsProcess Programs Are Not Backward Compatible, Programs Edited on New Models Cannot Run on Current ModelsWire CapabilitiesLongest Wire Citations:7.6 mm for 1.0 mil wire3.0 mm for 0.6 mil wireMinimum wire heightUltra low wire for "Force" series low wire40 pm for 0.6 mil wireTwist and turnWire length < 2.54 mm: 25 μm @ 3 sigmaWire length > 2.54 mm: ± 1% wire length @ 3 sigmaStyle changeover timeIf wire style remains the same, the following style changeover time applies.If wire style changes, the following style changeover time doubles.Same type of leadframe: <4 minutes(including time required to change heating block, platen and load program from disk)Different type of leadframe: <8 minutes(including time required to change wireframe width and length, change cassette size, change heating block, platen and load program from disk)Packaging equipment networkStandard-K&s ConnectK&S Connect can automatically transmit data generated by RPM for traceabilityOptional-KNet PLUSKNet PLUS helps improve efficiency, production capacity and yield rate by real-time monitoring of equipment status, collecting data and performing local or remote detection through user network. Please contact your local K&S sales representative for more information.Material Handling Capabilities:Package/Lead Frame SizesLength:90 to 300 mm(Lead frames shorter than 100 mm require additional short cassette handling tool)Width:15 to 92 mm (Standard)15 to 95 mm (Enlarged)25 to 100 mm (Extra Large)Thickness:0.10 to 0.9 mm(Lead frames thicker than 0.9 mm require additional Flat Boat tool)Pad Depth: Up to 2.3 mmCassette SizesWidth20 to 101 mmLength:50 to 178 mm127 to 305 mmHeight:Maximum Weight: 5.22 kgSlot Pitch: 127 to 25 mmHuman Machine InterfaceDisplay21.5″ Color LCD displayDurable operator panelUser-friendly interface with function keys, dedicated keys and comfortable mouseIndustry-proven user interfaceSimple drop-down menus with color-coded wire groups for easy programming and teachingEquipment operating requirementsMinimum air pressure: 3.52 Kg/sq.cm.(50 psi)Rated air consumption (flow)185 liters/minute @4.6 Kg/ sq.cm (6.5 CFM @ 65 psi)Shielding gas consumption (flow) for copper and silver wire weldingMinimum 0.6 liters/minuteMaximum 15 liters/minuteTypical 11 liters/minuteInput voltageStandard:200 to 240 V /AC:-15% to +10%Unidirectional 50 /60 Hz(+/-3 Hz)Or:100 to 115 V /AC: -15% to +10%Unidirectional 50 /60 Hz (+/-3 Hz)Rated power consumption1.5 KV/A (typical).2.6 KV/A (maximum)FootprintBasic equipment footprint plus material handling system889mm wide x1009mm deep (35"x 39.7")Net weight:590 kg (1300 lbs)Equipment plus outer packaging box 670 kg (1477 Ibs) Exhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonding,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment. Packaging & ShippingFAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:Why choose us ?A3:OEM/ODM/Designing.
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