IPDB › China Industry › Manufacturing & Processing Machinery
China, Chinese High Speed Fully Automatic Gold/Copper Wire Bonder1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Other Manufacturing Equipments for Electrical Electronic ProductWire BondingWire Bonder
Jiangsu Himalaya Semiconductor Co., Ltd.
Preview:
Product Description Product Description High-Speed Fully Automatic Gold/Copper Wire Bonder - Technical Description The High-Speed Fully Automatic Gold/Copper Wire Bonder represents the pinnacle of advanced wire bonding technology, designed for superior speed, precision, and reliability in semiconductor packaging. Engineered with cutting-edge servo systems, intelligent force calibration, and next-generation optical components, this system sets new benchmarks in ultra-fine wire bonding for IC, optoelectronic, and advanced microelectronic applications.This next-generation wire bonder combines ultra-high speed, sub-micron precision, and intelligent process control to meet the demands of advanced semiconductor manufacturing. With its modular design, self-calibration, and material flexibility, it is the ideal solution for high-mix, high-volume production. Wire Bonder Key Specifications Max Bonding AreaX: 56mm, Y: 80mmPositioning Accuracy±3μm (@3σ)Bonding Cycle Time45ms/wireWire Diameter RangeΦ15-50μm (Au/Cu/Al compatible)Drive SystemLinear Motor (Direct Drive)Repeatability±3μm (@3σ)Magazine CompatibilityL: 100-275mm, W: 30-90mm, H: 65-180mmMaterial HandlingVertical Stacked (2-3 magazines)Post-Bond InspectionHigh-Precision PBIDimensions (W×D×H)985mm × 960mm × 1770mmWeight≈660kgFeatureSpecification SpecificationKey Features & Innovations1. Enhanced Motion & PrecisionNew Servo System: Delivers faster response, higher positioning accuracy (±3μm @3σ), and improved UPH (Units Per Hour).Linear Motor-Driven XY Table:Maximum Bonding Area: X: 56mm, Y: 80mmRepeatability & Accuracy: ±3μm (3σ)Bonding Cycle: 45ms/wire (ultra-high throughput)2. Advanced Optical & Imaging SystemNew High-Performance Zoom Lens:Wider field of view with crisp, distortion-free imaging.Improved structural stiffness for vibration-free operation.High-Precision Post-Bond Inspection (PBI): Ensures defect-free interconnections.3. Intelligent Bonding Force ControlStable & Adaptive Force Feedback: Prevents wire breakage & pad damage.Smart Calibration System:Automatic prompts for real-time force recalibration.Fast, accurate, and easy calibration process.4. Superior Arc Control for Complex ApplicationsNew Wire Arc Algorithm: Optimized for multiple materials (Au, Cu, Al), ensuring consistent loop shapes even in high-density ICs (BGA, QFP, COB, etc.).5. Proprietary Core TechnologiesFully Independent IP (Intellectual Property):Drive system, optics, and control algorithms engineered in-house, ensuring industry-leading performance & reliability. Material Handling & Workflow Efficiency1. Automated Loading/UnloadingVertical Stacked Material Handling:Input/Output Mechanism: 2-3 magazines (buffered)Magazine Compatibility:Length: 100-275mmWidth: 30-90mmHeight: 65-180mmPitch Adjustment: 1.5-10mm2. Fast & Reliable ProductionSoldering Cycle: 45ms/lineWire Diameter Range: Φ15-50μm Applications Designed for high-volume production of advanced IC packages, including:TO, SOT, SOP, SSOP, TSSOPQFP, DIP, BGA, COB, OptocouplersFine-pitch & high-power devices Physical SpecificationsDimensions (W×D×H): 985mm × 960mm × 1770mmWeight: ≈660kgPower Supply: Optimized for industrial environments Exhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:How to choose a suitable machine?A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...