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China, Chinese Firing Furnace for Thick Film Products with Atmosphere Closed Loop Control1 Industrial Products Supplier Manufacturer Details, price list catalog:
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Other Manufacturing Equipments for Electrical Electronic ProductDbc Sintering FurnaceElectric Heating Equipment
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description Product Description CategorySpecificationTemperature RangeRT (Room Temperature) to 1100°CTemperature UniformityBetter than ±2°C across the furnaceNetwork Belt Speed20-150 mm/min (stepless adjustable)Heating RateAutomatically adjustable; maximum rate <2°C/minAtmosphere ControlNitrogen-oxygen mixed gas; oxygen content adjustable (20-300 ppm)Temperature Zones8-10 independent control zonesNetwork Belt Width200 mm1,Technical indicatorsThe use of temperature RT-1100 CThe uniformity of the furnace is better than that of 2 CNetwork belt running speed 20-150mm/min stepless adjustableThe adjustable heating rate of the automatic heating rate is less than 2 /minNitrogen and oxygen mixed gas oxygen content 20-300pp adjustable8-10 temperature zone in temperature control zoneNetwork band width 200mm 2,ProgressivenessThe oxidation atmosphere is uniform, the atmosphere is segmented and controllable, the temperature uniformity is high (high uniformity), the automatic heating can be adjusted, the safety and protection function is complete, the maintenance operation is convenient, the energy saving and environmental protection, the atmosphere closed loop control, the high temperature anti deformation structure, and the unique temperature control mode are unique.3,Detail displayApplicationExhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:How to choose a suitable machine?A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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