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China, Chinese LED Packaging Wire Bond Machine / Factory Wholesale Semicon Chip Wire Bonder for University Lab Research1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Other Manufacturing Equipments for Electrical Electronic ProductWire BonderWire Bonding Machine
Guangzhou Minder-Hightech co.,Ltd
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Product Description Here we provide 3 types of most competitive manual wire bonder, thin aluminum wire wedge bonder(25-75um aluminum wire);heavy aluminum wire wedge bonder(75-500um aluminum wire);gold wire ball bonder(17-50um gold wire). they are very popular for samll quantity production, school, institution, research department.1.Thin wire bonder MDB-2575:Application:Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.Electric requirement220VAC±10%,50HZ,be sure connected to groundwire diameter25~75μmultrasonic power0-3W, two channel. can be set separately of the two pointbond time5-200ms,two channelbond force10-60g,two channelspan between first bond to second bond by automatic mode0-10mm(motorized)bond radian0-6mm(motorized)jig moving areaΦ16mmmouse hand20*20mmdigital cameraoptionaldimension600*560*390mmweight36kg2:Heavy wire bonder MDB-7550:Application:High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126, TO-12F,TO-66,TO-251,TO-202 etc.electric requiement220VAC±10%,50HZ,be sure connected to groundaluminium wire diameter75~500μm (3~20mil)ultrasonic power0-30W, two channel.can be set separately of the two pointbond time10-500ms,two channelbond force30-1200g,two channelmotorized Y0-18mmmicroscope rate7.5 and 15working areaΦ25mmlightadjustable brightnesssize620×610×560mmweight~40kg3:gold wire ball bonder MDBB-1750:Application:LED, chips, diode, laser tube, the inner lead, semiconductor devices etc.electric requiement220VAC±10%,50HZ,be sure connected to groundwire diameter17~50μmultrasonic power0-3W, two channel. can be set separately of the two pointbond time0-200ms,two channelbond force35-180g,two channeldigital camera systermoptionalmin bonding time0.4s/wirespan between first bond to second bond by automatic modemore than 4mm.length of terminal wire0-2mmball dimension2-4 times bigger setablebond temperaturehouse temperature ~ 400°Cjig moving areaΦ25mmmicroscope15X,30Xdimension700*460*550mmweight28kgApplication:Customer useing:Machine Real shooting:Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. FAQ1. About Price:All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.2. About Sample:We can provide sample production services for you, but you may provide some fees.3. About Payment:After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.4. About Delivery:After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.5. Installation and Debugging:After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.6. About Warranty:Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
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