IPDB › China Industry › Manufacturing & Processing Machinery
China, Chinese Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing System1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterDie BonderDie Bonding
Jiangsu Himalaya Semiconductor Co., Ltd.
Preview:
Product Description Semiconductor High Precision COB Smart Die Bonding Machine with Automatic Dispensing SystemProduct DescriptionEquipment Specifications DIE BONDERSHD8060 Bonding methodEutectic Bonding precisionX/Y ±0.04mm Bonding speed (UPH)20K(Chip size 0.3mmX0.3mm,SOT23-13R frame) Chip size0.2mmx0.2mm~2.3mmx2.3mm Wafer size3~8 inches (with 8-inch work frame) Frame typeSilver-plated frame,bare copper frame,nickel-plated frame(up to 65mm wide) Frame movementRoller feeding (Tape reel frame) Chip rotation angle ±3° Wafer movementMechanical advancement Top chip angle 0°to 360° Bonding headVacuum surface suction Bonding arm 180° Bonding strength20~200g Adaptable nozzleSteel nozzle,rubber nozzle,bakelite nozzle Image recognition256-level grayscale Resolution640×480 pixels Recognition accuracy0.025mil~50mil observation range Dimensions(mm1900*1240*1350 Equipment weight (kg)About 600kgExhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:Why choose us?A3:OEM/ODM/Designing service.
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...