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China, Chinese Small Batch Production Desktop Vision Dispensing Machine with Continuous Compensation Function1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Glue Dispensing SystemDispensing MachineFactory Price
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description Product DescriptionTSV-200D Desktop Vision Glue Dispensing Machine - Product DescriptionPrecision. Efficiency. Intelligence.The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor Co., Ltd. is a high-precision, automated dispensing solution designed for industries requiring micron-level accuracy in adhesive application. Equipped with CCD visual positioning, multi-axis servo control, and intelligent programming, this machine ensures flawless dispensing for semiconductor packaging, advanced PCB assembly, MEMS devices, and high-precision electronics manufacturing. Key Features & AdvantagesUltra-Precise Dispensing for Semiconductor ApplicationsRepeatability: ±0.025mm (ideal for micro-dots, underfill, and die-attach adhesives)Max Speed: 800mm/s (optimized for high-throughput production)Multi-Axis Servo Control (X, Y1, Y2, Z) - Ensures smooth motion for complex dispensing pathsSmart CCD Vision AlignmentAutomated Pattern Recognition - Compensates for substrate misalignmentReal-Time Inspection - Detects missing glue or dispensing errorsSemiconductor-Grade Control SystemIndustrial PC + High-Speed Motion Control CardUser-Friendly Anda Software with drag-and-drop programmingSupports SECS/GEM Protocol for seamless integration into smart factoriesReliability & Cleanroom CompatibilityVacuum Nozzle Cleaning System - Prevents clogging in precision applicationsAnti-Static Design (ESD Protection) - Critical for semiconductor environmentsLow-Particulate Construction - Suitable for ISO Class 5-8 cleanroomsOptimized for Semiconductor WorkflowsWorking Area: X1/X2 (260mm), Y1/Y2 (260mm), Z (100mm) - Fits wafer trays & JEDEC carriersCompact Footprint (1120×740×760mm) - Saves valuable cleanroom space SpecificationsTSV-200DHSV-200DDimension (mm) L1120×W740×H760 L1200×W740×H146Weight (kg) 100 130Control Industrial personal computer + motion control cardSoftware Anda control software + windows systemProgramming Visual programmingNumber of spindles X,Y1,Y2,ZSpindle drive Servo motor + moduleWorking area (mm) X1 X2: 260; Y1 Y2: 260; Z: 100Quantity of rubber valve 1 (standard configuration)Max. Moving speed (mm/s) 800Repeatability (mm) ± 0.025Coating capacity (cc) 30Valve nozzlecleaning device Vacuum cleaningEquipment alarm Menu + sound and light alarmCoating inspection Automatic detectionPower supply 220V 50/60HzRequired air pressure (Mpa) ≥ 0.65Safety standards CERated power (kw) 1.3 1.5Standard function CCD visual positioningElectrostatic interface232 scanner socket Applications Key Applications in Semiconductor & Advanced ElectronicsFlip-Chip Underfill DispensingDie Attach Adhesive Application Wafer-Level Packaging (WLP) EncapsulationAdvanced PCB Assembly (SiP, Fan-Out)MEMS & Sensor PackagingEngineered for high-mix, low-volume semiconductor production as well as high-volume manufacturing, the TSV-200D delivers consistent, repeatable dispensing with near-zero waste. CertificationsWe are an ISO 9001-certified manufacturer and innovator specializing in semiconductor equipment, with 6 registered utility model patents (UM Patents) in China. Our patented technologies cover:Semiconductor annealing systemsCleaning equipment for semiconductor etchingUV debonding machinesAnd more .Backed by ISO 9001 quality management, we ensure high precision, reliability, and efficiency in semiconductor manufacturing processes. Our R&D-driven solutions enhance production yield and cost-effectiveness for global clients in IC packaging, MEMS, and advanced wafer processing.Partner with us for cutting-edge, patent-protected semiconductor equipment tailored to your needs.Exhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:How to choose a suitable machine?A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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