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China, Chinese Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterDie BonderDie Bonding Machine
Guangzhou Minder-Hightech co.,Ltd
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Product Description Product Description DB-141AAutomatic High Precision Die BonderApplicationsSpecificationsNo.DescriptionParameter1XY Placement accuracy+/-5 um @3 sigma2Die rotation accuracy+/-0.5° @3 sigma3Bonding force20 gf ~ 200 gf4Cycle time6 s5 Dispensing systemEpoxy Stamping 6Ejector module1 set7Wafer ring size6 inch*2 & 8 inch8Optics module4X lens / 500w camera / FOV:2.1x1.7mm / Precision:0.8um9 Substrate sizeWidth:50~100 mm / Length:50~200 mm10 Magazines2 pcs11ApplicationsDevices / Lidar / Sensor / SIP / MEMS...12Power Supply200-240V~3.5A, 50-60Hz13PneumaticCDA:0.5~0.6Mpa / VACUUM:-60~-80KPa14Dimensions(W x D x H)1240 x 1160 x 1830mm15Weight1100kgWe have 16 years of experience in equipment ,and can provide you with a one-stop IC Package Line Equipment solution
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