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China, Chinese Automatic FPC/RF/Touch ID/Type-C/TF-Card/LGA/BGA PCB Board Cutting Machine1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Other Manufacturing Equipments for Electrical Electronic ProductLaser Cutting MachineCutting Equipment
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description Automatic FPC/RF/Touch ID/Type-C/TF-Card/LGA/BGA PCB Board Cutting MachineProduct DescriptionProduct FeaturesSelect laser, fixture and stage according to actual product processing needsOne machine for drilling, cutting and scribing, reducing customer costsSupport full cutting / half cutting processSingle and double head, online, offline, automatic loading and unloading options, strong flexibilitySupport multi-feature CCD visual positioning, with automatic compensation functionApplicationPCB/FPC/RF/Touch ID/Type-C/TF-Card/LGA/BGA and other ty pes of modules,circuit boards, packaging IC carrierboard precision cutting, slotting Technical specification Laser wavelength355nm, 532nm, 1064nm, etc.Laser pulse widthNanosecond, picosecond, femtosecondLaser powerUV30W Max, Green60W MaxLaser Life>20,000 hoursProduct thickness≤2mmCutting Range350×400mm, can be customizedProcessing speed800mm/s(Max.)Platform AccuracyRepeat ≤1μm, positioning ≤3μmPositioning accuracy±5μm Exhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:Why choose us?A3:OEM/ODM/Designing service.
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