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China, Chinese Advanced Packaging Equipment High Accuracy Flip Chip Thermal Compression Bonder1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterThermal Compression BonderDie Bonder
Guangzhou Minder-Hightech co.,Ltd
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Product DescriptionProduct DescriptionMDSY-TCB30 Thermal Compression BonderThe equipment has the function of flip chip gold bumps (and other materials) bonding, which can meet the requirements of heating & pressure bonding and ultrasonic bonding.1. This machine is high accuracy flip chip Bonder for chip and substrate.2. Substrates set in trays are set on the mounting stage by the suction head.3. After picking up and flipping chips, transfers to the mounting head, performs flux dipping (option).4. Corrects chip position with image recognition, then conducts heat bonding.5. Also support ultrasonic, and eutectic is option.6. Also support regular bonding which do not need heating and pressure.SpecificationChip materialSi and othersChipsize0.3~30mmthickness:0.05 ~1.0 [mm]Supplymethods2,4Inch tray (waffle tray, gel-pak, metal tray etc)SubstratematerialSUS, Cu,Si, work piece, ceramic and othersTrayamounts2inchtray up to 8, or 4inch tray up to 2;Tray can be freely set for chip or substrate.Substrateouter size15~50[mm]& 8 [inch] waferSubstratethicknessFlatshaped base plate 0.1~3.0[mm];Tubeshaped bottom plate:A:0.1~2[mm] B:≤5[mm],C:≤7[mm]Theminimum distance from the chip to the inner wall of the can D: 21mmUPHApprox12 [sec/cycle] [Conditions of cycle time]Various Functions:1. Adjusts parallelism with the automatic leveling mechanism, the parallelism is less than 5μm with the range of 30×30[mm]. 2. The parallelism can be adjusted by manual up to 1μm. 3. Automatic flux dipping from flux bath is capable. Flux thickness can be adjusted for the work, and surface is evened by squeegee in every.4. Reduced gas (N2,N2+H2 so on) purge jig is used for eutectic bonding. 5. ID reader, reading tray ID, workpiece ID etc. to record production status. 6. The stage has vacuum adsorption function.7. Bonding process Parameter record, such as work pressure curve. temperature curve, ultrasonic vibration point, ultrasonic pressure and others is capable in every bonding.8. Work auto supply function.Mounting Accuracy:Flip Chip XY:±0.5[μm] * φ8 [inch] area (3σ)1.Use dedicated evaluation jig at room temperature. (XY Position)Measured with alignment camera of the machine. 2.Under the clean room environment, room temperature 23±2[℃], humidity 40 to 60[%] 3.The accuracy is when ultrasonic head and ultrasonic are not applied.Mounting Head Drive SectionZ axisResolution0.1[μ m]Movable range200[mm]SpeedMax.250[mm/sec]θ axisResolution0. 000225[°]Movable range±5[°]Chip holdingVacuum suction methodRecipe changeATC (automatic tool changer) method Maximum number of jigs to be changed:20x20[mm] 6 types *2 types when 30x30[mm] (option) is used.Pressure load section:Set rangeLow load range:0.049 to 4.9[N](5 to 500[g]) High load range:4.9 to 1000[N](0.5 to 102[kg]) * Load control that covers both range is not possible. * Ultrasonic horn is only for high-load areaPressure accuracyLow load range: ±0.0098[N](1[g]) High load range: ±5[%](3σ) * Both accuracies are for RT actual load.Mounting Head Pulse Heat SectionHeating methodPulse heat method (Ceramic heater)Set temperatureRT~450[°C] (1[°C]step)Temperature rising speedMax80[°C/sec] (without ceramic jig)Temperature distribution+5[°C] (30x30[mm] area)Cooling functionWith heat tool, work cooling functionUltrasonic horn sectionOscillation frequency40[kHz]Vibration rangeApproximately 0.3 to 2.6[μ m]Heating methodConstant heat method (ultrasonic horn)Set temperatureRT~250[°C] (1[°C]step)Tool sizeM6 tool replacement types (screw in type)*Needs to change to the rigid type for more than 7x7[mm] chip size.OthersNeed to replace with pulse heat head.Packing & DeliveryCompany ProfileSince 2014,Minder-Hightech is sales and service representative in Semiconductor and Electronic product industry equipment. We are committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.FAQ1. About Price:All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device. 2. About Sample:We can provide sample production services for you, but you may provide some fees. 3. About Payment:After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it. 4. About Delivery:After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment. 5. Installation and Debugging:After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee. 6. About Warranty:Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price. 7. After-sale Service:All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.
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