IPDB › China Industry › Manufacturing & Processing Machinery
China, Chinese Five-Axis Automatic High Speed Glue Dispensing Machine for SMT Product Line1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Glue Dispensing SystemDispensing MachineFactory Price
Jiangsu Himalaya Semiconductor Co., Ltd.
Preview:
Product Description Product Description 1. WINDOWS operating system - Using computer control, fault sound and light alarm and menu display2. CCD visual positioning system3. Adopt linear motor + motion control card4. Modular design - can be combined as required, including single platform, double platform, conveying system, glue path detection system.5. Automatic thermostatic system of valve - ensure consistent fluidity of paint6. Optional laser height detection system - the Z axis height can be automatically calibrated after the workpiece is deformed7. Optional precision weighing system - intelligent control and detection of dispensing volume, to ensure the consistency of dispensingSpecificationsADG-5DI Dimension (mm) L1166 * W1200 * H1600Control Industrial personal computer + motion control cardDispensing working area (mm) X1=200; X2=200; Y=200 Number of principle axis 5 axesDrive mode Linear motor (X,Y,A,U) / Servo motor(Z)Conveyor mode ESD beltAmplitude modulation mode Electric, 50-200mmConveyor speed Stepping motor, 2-5m/minMaximum Moving speed (mm/s) 1000Repeatability (mm) ±0.012Coating capacity (CC) 30/50Communication protocol SMEMAProgramming The mounter files can be imported; Online visual programmingInput power 220V 50/60HzRequired air (Mpa) ≥ 0.65Rated power (kw) 3Weight (kg) 500Equipment alarm Menu + Sound and light alarmSafety standards CEGlue valve selection Pneumatic injection valve, piezoelectric valve, screw valve can be usedOptions of extended function Booster pump; UPS; Voltage Regulator; Barcode scannerMicrobalance (0.1mg); Laser altimetry (SICK)Exhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:How to choose a suitable machine?A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...